Abstract: A process for producing an aqueous emulsion of a polyolefin having a weight-average molecular weight of 20,000 or higher, characterized in that a styrene/maleic anhydride copolymer or/and an ester of a styrene/maleic acid copolymer is used as a polymer dispersant.

Abstract: A process for producing an aqueous emulsion of a polyolefin having a weight-average molecular weight of 20,000 or higher, characterized in that a styrene/maleic anhydride copolymer or/and an ester of a styrene/maleic acid copolymer is used as a polymer dispersant.

Abstract: In a semiconductor device measuring socket, contact positions are adjustable by employing spacers. The semiconductor device measuring socket comprising: a wiring pattern board on which a test circuit is formed; a substantially S-shaped contact for electrically connecting the wiring pattern board to external leads arrayed on a semiconductor device; a supporting member for elastically supporting the contact under tiltable condition; a socket main body for storing thereinto the contact and the supporting member and for mounting the wiring pattern board on a lower portion of the socket main body; and adjusting means for adjusting a tilting amount of the contact with respect to the socket main body. When the wiring pattern board is mounted on the socket main body, a lower end portion of the contact which is projected from the lower surface of the socket main body is depressed by the wiring pattern board to thereby tilt the contact, whereby a contact position between the external lead and the contact is determined.

Abstract: A semiconductor device measuring socket includes a wiring pattern board on which a test circuit is formed; a substantially S-shaped contact for electrically connecting the wiring pattern board to external leads arrayed on a semiconductor device; a supporting member for elastically supporting the contact under tiltable condition; a socket main body for storing thereinto the contact and the supporting member and for mounting the wiring pattern board on a lower portion of the socket main body; and adjusting means for adjusting a tilting amount of the contact with respect to the socket main body. When the wiring pattern board is mounted on the socket main body, a lower end portion of the contact which is projected from the lower surface of the socket main body is depressed by the wiring pattern board to thereby tilt the contact, whereby a contact position between the external lead and the contact is determined.