Abstract: An optical device includes a metal film that has a first plane and a second plane electrically connected to the first plane. For example, the second plane is integrally formed with the first plane. The second plane is arranged at an obtuse angle ? (90°<?<180°) with respect to the first plane. An optical semiconductor chip is mounted on the second plane of the metal film, and a light-transmitting sealing material seals the optical semiconductor chip. The light-transmitting sealing material has the metal film provided on a surface thereof.

Abstract: An optical device includes a metal film that has a first plane and a second plane electrically connected to the first plane. For example, the second plane is integrally formed with the first plane. The second plane is arranged at an obtuse angle ? (90°<?<180°) with respect to the first plane. An optical semiconductor chip is mounted on the second plane of the metal film, and a light-transmitting sealing material seals the optical semiconductor chip. The light-transmitting sealing material has the metal film provided on a surface thereof.

Abstract: An LED can include a silicon substrate that has a conductive pattern including an LED chip equipped portion, a connection portion, and external electrodes. A glass frame can be anodic-bonded onto the silicon substrate, and can include a through-hole forming a lamp house. An LED chip can be mounted onto the silicon substrate in the through-hole of the glass frame, and a mold portion made of silicone resin can be filled into the through-hole of the glass frame.

Abstract: A surface-mountable glass-sealed light-emitting diode is provided. It has high reliability and high external quantum efficiency, and can achieve a low-cost components-implemented board. An LED bare chip (1) has opposite surfaces, which are provided with electrodes (2) for supplying power from external. A pair of dumet wires (3) are separately connected to the respective electrodes (2) sandwiching the LED bare chip (1) therebetween. The LED bare chip (1), the electrodes (2) and parts of the dumet wires (3) are integrally glass-sealed (4). A pair of metallic disc plates (6) have holes (5) formed through the center. They are secured on both sides of the glass seal (4) and solder-plated, allowing the pair of dumet wires (3) projected from the glass seal to pass through the holes (5).

Abstract: A surface-mountable glass-sealed light-emitting diode is provided. It has high reliability and high external quantum efficiency, and can achieve a low-cost components-implemented board. An LED bare chip (1) has opposite surfaces, which are provided with electrodes (2) for supplying power from external. A pair of dumet wires (3) are separately connected to the respective electrodes (2) sandwiching the LED bare chip (1) therebetween. The LED bare chip (1), the electrodes (2) and parts of the dumet wires (3) are integrally glass-sealed (4). A pair of metallic disc plates (6) have holes (5) formed through the center. They are secured on both sides of the glass seal (4) and solder-plated, allowing the pair of dumet wires (3) projected from the glass seal to pass through the holes (5).

Abstract: A cartridge container of the character to be mounted in an office machine into and from which a viscous fluid such as ink is supplied and sucked out, comprises: a lower half container section made of a rigid material and an upper half container section made of a pliant sheet material, both sections being bonded along their opening edges and communicating with each other internally when both sections are thermally bonded. The upper half container section has a shape or dimensions to be substantially entirely foldable into the interior of the lower half container section in a reversely turned-over condition so as to closely oppose the inner wall of the lower half container section when the viscous fluid in the cartridge container is substantially entirely sucked out therefrom through a spout disposed at the lower portion of the lower half container section.