Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.

Abstract: The present invention relates to a mounting structure for electronic apparatus mounting electronic parts with a high mounting density. The present invention is capable of supplying power to a printed wiring board from a power supply without a voltage drop through a very short wiring distance. Both the power supply and printed wiring board are cooled with a common air cooling fan, and the power supply, bus plate and printed wiring board are integrally assembled and connected.

Abstract: A cooling device located between a cooling plate having a first coolant circulating therein, and an electronic part to be cooled, mounted on a printed-wiring board, comprising a hollow part being thermally conductive, having a hollow chamber through which the first coolant circulates, and connected to the cooling plate by a flange part being thermally conductive, a thermal conduction plate attached to a surface of the electronic part and connected to the flange part by a bellows providing a space among the hollow part, the bellows and the thermal conduction plate, and a second liquid coolant filling the space for transferring heat from the thermal conduction plate to the hollow part by a convection current of the second coolant. The second coolant is made of alloy being chemically inactive to the bellows and having a low melting point so as to be liquid at ordinary temperatures.

Abstract: A flexible current feeding post for electronic modular assemblies interconnects parallel oriented substrates such as printed circuit boards having electrical circuits mounted thereon and bus plates for power supply, for both mechanical assembly and current distribution. The flexible current feeding post comprises a solid, cylindrical stud for connection to a contact surface of one substrate, a conductive bellows connected to the stud and means connecting the conductive bellows to a contact surface of a second substrate, spaced from the first substrate by a desired distance and generally parallel thereto.