Abstract: A socket for connecting the contact pads (34) of an electrical circuit board (5) to the contact points (32) of an integrated circuit package (14). The socket has a socket body (7) including a first plurality of holes (27) and a floating guide plate (12) including a second plurality of holes (24). A plurality of contact springs (11) are supported between the socket body (7) and the floating guide plate (12). Each contact spring (11) has a first end (21) and a second end (22) with a resilient part (20) between the first end and the second end.

Abstract: A chip carrier socket for solid state electronic chip carrier packaged elements made up of a hollow body having a cover, a hinged top on the body providing a space between the top and the body, a chip carrier to be placed in the space and serpentine shaped springs in the hollow body and extending upwardly therethrough to engage electronic metalized pad areas on said chip carrier package. The lower end of the springs being adapted to rest on a bottom closure, the lower ends of the springs extending out through the bottom closure and the upper end of the springs extending through the top of the body and being slidable relative thereto.