Patents by Inventor J. Bishop

J. Bishop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11997829
    Abstract: Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: May 28, 2024
    Assignee: Ciena Corporation
    Inventors: Simon J. E. Shearman, Michael R. Bishop, Jacques Cote
  • Publication number: 20240169942
    Abstract: Improved methods for driving an active matrix of pixel electrodes controlled with thin film transistors when the voltage on a top electrode is being altered between driving frames. The methods described increase performance by providing smaller swings in the overall voltage between the top electrode and pixel electrode while reducing stress on the thin film transistor.
    Type: Application
    Filed: January 29, 2024
    Publication date: May 23, 2024
    Inventors: Kenneth R. CROUNSE, Stephen J. TELFER, Ana L. LATTES, Christopher L. HOOGEBOOM, Richard J. PAOLINI, JR., Seth J. BISHOP
  • Publication number: 20240164913
    Abstract: An implant may include a body including a ring, the ring further defining an opening, and the body defining a transverse plane dividing the implant into a superior half and an inferior half. The ring may also define a circumferential direction. The implant may further include a first outer member attached to the ring, wherein the first outer member extends outward in a direction away from the ring, wherein the first outer member defines one or more arches, and wherein the ring further defines a central channel extending through the implant.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Inventors: Sean S. Bishop, Christopher J. Ryan, Edward J. McShane, III, Megan A. Stauffer, Joseph M. Nyahay
  • Patent number: 11985454
    Abstract: A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”); one or more circuits mounted to the PCB; and a faceplate that including a plurality of plates, angled relative to one another, such that the faceplate includes increased surface area relative to a substantially flat faceplate, wherein at least two plates of the plurality of plates include physical ports each having track lengths to a circuit of one or more circuits, wherein one or more of the physical ports support signals at a rate of at least 100 Gbps. Each plate of the plurality of plates can be flat. Any of the plurality of plates can include physical ports. The physical ports can be pluggable modules. Each type of the physical ports can be a same type on a given plate.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: May 14, 2024
    Assignee: Ciena Corporation
    Inventors: Simon J. E. Shearman, Fabien Colton, Daniel Rivaud, Michael R. Bishop
  • Patent number: 11960128
    Abstract: A photonics package may include a substrate, a hanging connector, and a fast-axis collimator (“FAC”). The hanging connector is typically affixed to a side of the substrate other than the side through which a light output is emitted. The hanging connector may be L-shaped in cross-section, having a base section and an extended section projecting from the base section. The base section affixes to the substrate while the extended section affixes to the FAC, so that the FAC extends downward along the emitter surface of the substrate; a vertex of the FAC is coplanar with an emitter outputting the light output.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Apple Inc.
    Inventors: Alexander Goldis, Jeffrey T. Hill, Michael J. Bishop
  • Patent number: 11960131
    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: April 16, 2024
    Inventors: Michael J. Bishop, Vijay M. Iyer, Jason S. Pelc, Mario J. Costello
  • Publication number: 20240117533
    Abstract: A woven structure formed by warp and weft tows A, E of fiber reinforcement material includes: a plurality of multi-warp stacks SA, each including a plurality of warp tows A which are in superposition along a longitudinal extent of the warp stack SA, a plurality of multi-weft stacks SE, each including a plurality of weft tows E which are in superposition along the stack SE, wherein one or more multi-warp stacks SA and/or one or more multi-weft stacks SE has an embedded taper structure, including: an embedded tow A1, A2, E1, E2 which has a terminal portion M1, M2 disposed between two locally outermost tows A0, E0 of the respective stack SA SE, the terminal portion M1, M2 terminating at a taper position D1 D2 along the respective path of the stack SA SE; and a method for manufacturing a composite component.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 11, 2024
    Applicant: ROLLS-ROYCE PLC
    Inventors: Christopher D. JONES, Adam J. BISHOP, Sarvesh DHIMAN, Ian BUCK
  • Publication number: 20240114665
    Abstract: Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Simon J. E. Shearman, Michael R. Bishop, Jacques Cote
  • Patent number: 11938039
    Abstract: An implant may include a body including a ring, the ring further defining an opening, and the body defining a transverse plane dividing the implant into a superior half and an inferior half. The ring may also define a radial direction and a circumferential direction. The implant may further include a first outer member attached to the ring, wherein the first outer member extends radially from the ring, wherein the first outer member defines one or more arches, and wherein the ring further defines a central channel extending through the implant.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Institute for Musculoskeletal Science and Education, Ltd.
    Inventors: Sean S. Bishop, Christopher J. Ryan, Edward J. McShane, III, Megan A. Stauffer, Joseph M. Nyahay
  • Patent number: 11934593
    Abstract: A magneto-electrophoretic medium that can be globally and locally addressed and erased. The medium provides a writeable display with no perceivable lag and the ability to write and erase with only minimal power requirements. In particular, the magneto-electrophoretic medium can be erased by providing a subthreshold electric stimulus and supplementing a second non-electric stimulus that disturbs the written state and allows the magneto-electrophoretic particles to return to their original state.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: March 19, 2024
    Assignee: E Ink Corporation
    Inventors: Crystal Nguyen, Evan Griffith, Seth J. Bishop, Stephen J. Telfer, Kosta Ladavac, Andrew A. Drabek, Sunil Krishna Sainis, Richard J. Paolini, Jr., Samantha Morrill
  • Patent number: 11922893
    Abstract: Improved methods for driving an active matrix of pixel electrodes controlled with thin film transistors when the voltage on a top electrode is being altered between driving frames. The methods described increase performance by providing smaller swings in the overall voltage between the top electrode and pixel electrode while reducing stress on the thin film transistor.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: March 5, 2024
    Assignee: E Ink Corporation
    Inventors: Kenneth R. Crounse, Stephen J. Telfer, Ana L. Lattes, Christopher L Hoogeboom, Richard J. Paolini, Jr., Seth J. Bishop
  • Patent number: 11923654
    Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Michael J. Bishop, Jason Pelc, Vijay M. Iyer, Alex Goldis
  • Patent number: 11911398
    Abstract: Methods and compositions for treating 25-hydroxyvitamin D insufficiency and deficiency in a patient are described herein. The method includes orally administering to the patient a delayed, sustained release formulation including a first ingredient selected from the group consisting of 25-hydroxyvitamin D2, 25-hydroxyvitamin D3, or a combination of 25-hydroxyvitamin D2 and 25-hydroxyvitamin D3, or it includes gradually administering to the patient a sterile intravenous formulation including a first ingredient selected from the group consisting of 25-hydroxyvitamin D2, 25-hydroxyvitamin D3, or a combination of 25-hydroxyvitamin D2 and 25-hydroxyvitamin D3.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: February 27, 2024
    Assignee: OPKO RENAL, LLC
    Inventors: Charles W. Bishop, Keith H. Crawford, Eric J. Messner
  • Publication number: 20240035210
    Abstract: A method for manufacturing a composite component, including: weaving a multi-layer woven preform from warp and weft tows of fibre-reinforcement material, the woven preform includes: multi-layer weave including: plurality of weft tow layers; plurality of laterally-adjacent stacks extending along the longitudinal direction, primary portion having longitudinal extent along woven preform, the primary portion having one or more edge regions each defining respective lateral side of primary portion; wherein for the or each edge region: the multi-layer weave defines at least the edge region; plurality of stacks in the edge region are binding stacks in which one or more warp tows are interlaced to bind a respective plurality of weft tow layers; weave property differs between binding stacks in the edge region to reduce a thickness of the edge region towards respective lateral side. Also disclosed herein is a woven structure, formed by warp and weft tows of fibre reinforcement material.
    Type: Application
    Filed: July 12, 2023
    Publication date: February 1, 2024
    Applicant: ROLLS-ROYCE plc
    Inventors: Christopher D. JONES, Adam J. BISHOP, Richard HALL, Ian BUCK, Sarvesh DHIMAN
  • Publication number: 20240025131
    Abstract: A woven composite component for an aerospace structure or machine, comprising: a compound member extending from a junction with a feeder member, a noodle element extending in a weft direction through the junction. The feeder member comprises first and second feeder portions either side of the junction, each feeder portion comprising warp tows extending towards the junction. There is a compound set of warp tows extending from the first and second feeder portions, each turning at the junction to define warp tows for the compound member. There is a crossing set of warp tows belonging to the compound set, the crossing set comprising warp tows from the first feeder portion and warp tows from the second portion which cross each other at the junction to pass around the noodle element. There is also disclosed a method of manufacturing a preform for a woven composite component.
    Type: Application
    Filed: July 12, 2023
    Publication date: January 25, 2024
    Applicant: ROLLS-ROYCE PLC
    Inventors: Christopher D. JONES, Robert C. BACKHOUSE, Adam J. BISHOP, Ian BUCK, Sarvesh DHIMAN
  • Patent number: 11881678
    Abstract: Configurations for a photonics assembly and the operation thereof are disclosed. The photonics assembly may include multiple photonics dies which may be arranged in an offset vertical stack. The photonics dies may emit light, and in some examples, an optical element may be a detector for monitoring properties such as the wavelength of the light. The photonics dies may be arranged in a stack as a package and the packages may be stacked or arranged side by side or both for space savings. The PIC may include combining and/or collimating optics to receive light from the photonics dies, a mirror to redirect the light, and an aperture structure. The aperture structure may include a region which is at least partially transparent such that light transmits through the transparent region of the aperture structure. The aperture structure may include an at least partially opaque region which may be used for directing and/or controlling the light launch position.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: January 23, 2024
    Assignee: Apple Inc.
    Inventors: Michael J. Bishop, Kwan-Yu Lai, Alex Goldis, Alfredo Bismuto, Jeffrey Thomas Hill
  • Publication number: 20240019753
    Abstract: Systems and methods are disclosed for pressure-sensitive, electrophoretic displays, which may optionally include haptic feedback. A display may comprise a first conductive layer having a pressure-sensitive conductivity and an electrophoretic layer positioned adjacent to the first conductive layer, wherein the electrophoretic layer is in electrical communication with the first conductive layer and is configured to locally change state based on a pressure applied to the first conductive layer. Local and global writing and erasing of the display can also be achieved.
    Type: Application
    Filed: September 28, 2023
    Publication date: January 18, 2024
    Inventors: Sunil Krishna SAINIS, Seth J. BISHOP, Kosta LADAVAC, Stephen J. TELFER, Richard J. PAOLINI, JR.
  • Publication number: 20230356949
    Abstract: A dedicated access module inserted between standard conveyor belt modules in a conveyor belt forms a dedicated opening and closing point for the conveyor belt. The dedicated access module comprises two mating portions, each portion including standard, articulating hinge elements on an outside end and non-articulating connection means on an inside end for connecting to the other, corresponding mating portion.
    Type: Application
    Filed: September 30, 2021
    Publication date: November 9, 2023
    Inventors: Gilbert J. MacLachlan, Angela Longo Marshall, Kevin W. Guernsey, Benson Hall, Matthew Vulpetti, Jonathan J. Bishop, Jacob Govert Vermeiden, Andrzej Jacek Gonera
  • Patent number: 11809057
    Abstract: Systems and methods are disclosed for pressure-sensitive, electrophoretic displays, which may optionally include haptic feedback. A display may comprise a first conductive layer having a pressure-sensitive conductivity and an electrophoretic layer positioned adjacent to the first conductive layer, wherein the electrophoretic layer is in electrical communication with the first conductive layer and is configured to locally change state based on a pressure applied to the first conductive layer. Local and global writing and erasing of the display can also be achieved.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: November 7, 2023
    Assignee: E Ink Corporation
    Inventors: Sunil Krishna Sainis, Seth J. Bishop, Kosta Ladavac, Stephen J. Telfer, Richard J. Paolini, Jr.
  • Publication number: 20230286904
    Abstract: Disclosed herein are synthesis and use of covalent inhibitors selective for Transcriptional Enhancer Factor TEF-1 (TEAD1), which can be used for treatment of cancers such as glioblastoma, gastric cancer, colorectal cancer, pancreatic ductal adenocarcinoma (PDAC), and malignant pleural mesothelioma (MPM). Further disclosed herein are pharmaceutical compositions including the TEAD1 inhibitor and methods of treating cancers using the same.
    Type: Application
    Filed: July 2, 2021
    Publication date: September 14, 2023
    Inventors: Chao ZHANG, Michael J. BISHOP, Hang CHEN, Ping CAO