Patents by Inventor Jüergen Niess

Jüergen Niess has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for thermally processing a plurality of wafer-shaped objects
    Patent number: 7977258
    Abstract: Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: July 12, 2011
    Assignee: Mattson Technology, Inc.
    Inventors: Zsolt Nenyei, Paul J. Timans, Wilfried Lerch, Jüergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O'Carroll, Rudy Cardema, Igor Fidelman, Sing-Pin Tay, Yao Zhi Hu, Daniel J. Devine