Abstract: A bumped chip has a plurality of finger-like bumps bonded on multiple openings of a chip. The chip primarily comprises a plurality of bonding pads and a passivation layer having a plurality of opening thereon. In one embodiment, the openings on each bonding pad are plural and disposed in linear, in parallel, or in an array. The finger-like bumps are protrusively disposed on the chip and each has a bump core and an extension finger. The bump cores are disposed within the corresponding bonding pads and cover the openings, and the extension fingers are disposed outside the corresponding bonding pads to maintain the bonding strengths of the bumps even at fine pitches. In an embodiment, the extension fingers overlap at least a trace of the chip.