Patents by Inventor J. G. E. Gardeniers

J. G. E. Gardeniers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microneedle Structure And Production Method Therefor
    Publication number: 20110073560
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Application
    Filed: December 2, 2010
    Publication date: March 31, 2011
    Applicant: Nanopass Technologies Ltd.
    Inventors: Yehoshua Yeshurun, Mier Hefetz, Meint De Boer, J.W. Berenschot, J.G.E. Gardeniers
  • Microneedle structure and production method therefor
    Patent number: 7850657
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: December 14, 2010
    Assignee: Nanopass Technologies Ltd.
    Inventors: Yehoshua Yeshurun, Meir Hefetz, Meint de Boer, J.W. Berenschot, J.G.E. Gardeniers
  • Microneedle Structure And Production Method Therefor
    Publication number: 20100106105
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Application
    Filed: January 4, 2010
    Publication date: April 29, 2010
    Applicant: NANOPASS TECHNOLOGIES LTD.
    Inventors: Yehoshua Yeshurun, Meir Hefetz, Meint De Boer, J.W. Berenschot, J.G.E. Gardeniers
  • Microneedle structure and production method therefor
    Patent number: 7648484
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: January 19, 2010
    Assignee: Nanopass Technologies Ltd.
    Inventors: Yehoshua Yeshurun, Mier Hefetz, Meint De Boer, J. W. Berenschot, J. G. E. Gardeniers
  • Microneedle structure and production method therefor
    Publication number: 20050029223
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecing from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Application
    Filed: August 28, 2001
    Publication date: February 10, 2005
    Inventors: Yehoshua Yeshurun, Mier Hefetz, Meint De Boer, J. W. Berenschot, J. G. E. Gardeniers
  • Microneedle structure and production method therefor
    Patent number: 6533949
    Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: March 18, 2003
    Assignee: Nanopass Ltd.
    Inventors: Yehoshua Yeshurun, Meir Hefetz, Meint de Boer, J. W. Berenschot, J. G. E. Gardeniers