Abstract: A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liquid reaching the output over the wafer by flowing a gas into the conduit through a venturi opening formed in the conduit. The liquid with dissolved gas is then fed through the opening and onto the wafer where it can be used to etch, clean, or rinse a wafer.

Abstract: A single wafer cleaning apparatus that includes a rotatable bracket that can hold and rotate a wafer and that also includes a UV light tube capable of being positioned parallel to, and a short distance from, a wafer top surface to radiate oxygen above the wafer top surface with UV light rays to produce ozone.

Abstract: A single wafer cleaning apparatus that includes a rotatable bracket that can hold a wafer, a rinse fluid having a first surface tension, a second fluid having a second surface tension lower than the first surface tension, a first nozzle capable of applying the rinse fluid at a first location on the wafer positioned in the bracket, second nozzle capable of applying the second fluid at a second location on the wafer where the second location is inboard of the first location, and the first nozzle and the second nozzle are capable of moving across the wafer to translate the first location and the second location from the wafer center to the wafer outer edge.

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising:

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising:

Abstract: The present invention is a novel termination of silicon dioxide films for use in a single wafer cleaning tool. According to the present invention a silicon dioxide film is formed on a silicon substrate and the film is then terminated with ammonium oxide (—O—NH4). In an embodiment of the present invention the film is terminated by dispensing a mixture containing ammonium oxide onto the film. The present invention also provides a method of forming a gate insulator as well as a gate insulator device.

Abstract: The present invention is a novel termination of silicon dioxide films for use in a single wafer cleaning tool. According to the present invention a silicon dioxide film is formed on a silicon substrate and the film is then terminated with ammonium oxide (—O—NH4). In an embodiment of the present invention the film is terminated by dispensing a mixture containing ammonium oxide onto the film. The present invention also provides a method of forming a gate insulator as well as a gate insulator device.

Abstract: The present invention is a novel rinsing solution and a novel rinsing method for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises water, an acid, and hydrogen gas. In an embodiment of the present invention the rinsing step would also comprise the filtering of ammonia (NH3) from the air around the cleaning station. In another embodiment of the present invention the rinsing step would be followed by a drying step that uses velocities of air exceeding 0.1 m/s.

Abstract: The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H2. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.

Abstract: A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.

Abstract: The present invention is a method of reducing adhered moisture on a wafer. According to the present invention a wafer is first spun dry. After spinning the wafer dry the wafer is passed under a linear source of isopropyl alcohol (IPA) vapor.

Abstract: A chuck for holding a wafer that includes a number of moveable clamping arms each pivotally attached to one or more fixed support structures; and a center-of-mass of each of the moveable clamping arms positioned a distance from the pivot point of each of the moveable clamping arms, such that when the chuck is at rest, the number of moveable clamping arms rotate to release a grip on the wafer, and when the chuck is rotating, the clamping arms rotate to grip the wafer.

Abstract: A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liquid reaching the output over the wafer by flowing a gas into the conduit through a venturi opening formed in the conduit. The liquid with dissolved gas is then fed through the opening and onto the wafer where it can be used to etch, clean, or rinse a wafer.

Abstract: The present invention is a method of assisting the rinsing of a wafer in a single wafer cleaning apparatus. According to the present invention, after exposing a wafer to a cleaning and/or etching solution, the cleaning or etching solution is removed from the wafer by spinning the wafer and dispensing or spraying DI water onto the wafer as it is spun. The centrifugal force of the spinning wafer enhances the rinsing of the wafer. In order to enhance the rinsing of the wafer, in an embodiment of the present invention a solution having a lower surface tension than water, such as but not limited to isopropyl alcohol (IPA) is dispensed in liquid or vapor form onto the wafer after the DI water.

Abstract: A method and apparatus for processing a wafer is described. According to the present invention a wafer is placed on a substrate support. A liquid is then fed through a conduit having an output opening over the wafer. A gas is dissolved in the liquid prior to the liquid reaching the output over the wafer by flowing a gas into the conduit through a venturi opening formed in the conduit. The liquid with dissolved gas is then fed through the opening and onto the wafer where it can be used to etch, clean, or rinse a wafer.

Abstract: The present invention is a single wafer process apparatus which includes a rotatable wafer support for rotating a wafer about its central axis. Additionally, the single wafer processing apparatus includes a plurality of liquid spray nozzles for creating a spray pattern of liquid onto a wafer located on the wafer support wherein the entire surface of the wafer is covered with the spray pattern.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.