Patents by Inventor J. King Chen

J. King Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin metal substrate having high thermal conductivity
    Patent number: 9902137
    Abstract: A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: February 27, 2018
    Assignee: AISA ELECTRONIC MATERIAL CO., LTD
    Inventors: Meng Hao Chang, Chien Hui Lee, J. King Chen
  • THIN METAL SUBSTRATE HAVING HIGH THERMAL CONDUCTIVITY
    Publication number: 20130040120
    Abstract: A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.
    Type: Application
    Filed: April 3, 2012
    Publication date: February 14, 2013
    Applicant: AISA ELECTRONIC MATERIAL CO., LTD
    Inventors: Meng Hao Chang, Chien Hui Lee, J. King Chen