Abstract: A package for one or more semiconductor die is disclosed, along with a method of making the package. In one embodiment, the package includes a substrate having opposed top and bottom surfaces and an aperture therebetween. The substrate includes an insulative layer and top and bottom metal layers on the insulative layer around the aperture. The metal layers are electrically connected through the insulative layer. At least one die is supported within the aperture by an insulative encapsulant material. The bottom surface of the die is exposed. In alternative embodiments, a stack including a plurality of die (e.g., two die) are supported in the aperture. Rectangular metal are provided in a single row on the bottom surface of the substrate along at least two edges of the package.