Patents by Inventor J. Shelton Lewis

J. Shelton Lewis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via heat sink material
    Patent number: 7592702
    Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: September 22, 2009
    Assignee: Intel Corporation
    Inventors: J. Shelton Lewis, Shawn Lloyd, Michael Kochanowski, John Oldendorf
  • Via heat sink material
    Patent number: 7124931
    Abstract: The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.
    Type: Grant
    Filed: November 18, 2003
    Date of Patent: October 24, 2006
    Assignee: Intel Corporation
    Inventors: J. Shelton Lewis, Shawn Lloyd, Michael Kochanowski, John Oldendorf
  • Integrated circuit package socket and socket contact
    Patent number: 7104803
    Abstract: An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: September 12, 2006
    Assignee: Intel Corporation
    Inventors: Shawn L. Lloyd, John G. Oldendorf, J. Shelton Lewis, Michael Kochanowski