Abstract: A method of evaluating a stepper process affected by lens aberration is provided. The method includes receiving, from a facilitator responding to a request, a set of optical models including lens aberration information, wherein the lens aberration information is difficult to extract from the optical models. A decision can be made using the set of optical models. The decision could include determining which stepper(s) can be used (or should be avoided) with a mask, a layout, a process, and/or a chemistry. The decision could include ranking a plurality of steppers based on mask data to determine the best stepper (or next best steppers) to use.

Abstract: Printing very small features on a wafer may require optimizing an illumination configuration in the lithographic imaging system. In a conventional system, an aperture provides only one illumination configuration. In contrast, a programmable aperture can ensure that each mask design is printed using its optimized illumination configuration while minimizing the amount of hardware in the system. The programmable aperture can include a grid of pixels, wherein each pixel can be controlled to provided a predetermined light state. Once installed, the programmable aperture can provide any number of illumination configurations, thereby eliminating the expense of fabricating, testing, and repairing multiple apertures as well as the time associated with installing those multiple apertures.

Abstract: Techniques are provided for manufacturing phase-shifted masks. According to one technique, a facilitator provides, on behalf of a set of one or more parties that desire masks, subsidies for production of phase-shifted masks. The manufacture of the phase-shifted masks is paid using compensation that includes the subsidies from the facilitator. One or more mask makers manufacture the phase-shifted masks for the compensation. The facilitator receives, from the set of one or more parties, compensation for the subsidies based on one or more factors including a factor that reflects market success of integrated circuits produced using the phase-shifted masks. In addition to the subsidies, the facilitator may provide a variety of value-added services.

Abstract: A method of optimizing a wafer fabrication process for a given mask is provided. The method includes capturing an image of a mask and simulating a wafer image of the mask. A mask map of information can then be generated based on the simulated wafer image. The resulting mask map can be provided to any downstream wafer fabrication process when such process involves the mask. One or more one input parameters to the downstream wafer fabrication process can be changed based on the mask map, thereby optimizing the process for the given mask.

Abstract: A method of optimizing a wafer fabrication process for a given mask is provided. The method includes capturing an image of a mask and simulating a wafer image of the mask. A mask map of information can then be generated based on the simulated wafer image. The resulting mask map can be provided to any downstream wafer fabrication process when such process involves the mask. One or more one input parameters to the downstream wafer fabrication process can be changed based on the mask map, thereby optimizing the process for the given mask.

Abstract: A method of evaluating a stepper process affected by lens aberration is provided. The method includes receiving, from a facilitator responding to a request, a set of optical models including lens aberration information, wherein the lens aberration information is difficult to extract from the optical models. A decision can be made using the set of optical models. The decision could include determining which stepper(s) can be used (or should be avoided) with a mask, a layout, a process, and/or a chemistry. The decision could include ranking a plurality of steppers based on mask data to determine the best stepper (or next best steppers) to use.

Abstract: Energy levels (dose) are manipulated to modify the resultant photomask representation in a controlled manner such that the final image in the semiconductor device fabrication is close to an ideal image. Feature sizes and shapes are modified by assigning relative mask writer doses rather than physically manipulating feature sizes in layout designs. This approach, based on coding of relative dose information onto the design data, allows continuous scale line width variation for all features without impact to data volume. Two embodiments are described. In the first embodiment, distortion knowledge in the form of a lookup table or convolution function is applied to CAD data which is fractured into numerous designs having specific dose assignments. In the alternative embodiment, distortion knowledge in the form of a lookup table or convolution function is applied to CAD data which generates an attribute file containing hierarchical dose information that is mapped onto the mask data.