Patents by Inventor Ja-Ho Choi

Ja-Ho Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240167820
    Abstract: An embodiment method of recognizing a parking floor for a vehicle includes recognizing a spot at which the vehicle enters a parking deck, obtaining an inclination signal indicating an inclination trajectory of the vehicle traveling during a parking period from entry to the parking deck to parking, obtaining an inclination pulse of the inclination signal based on a reference inclination value, and determining a floor number of the parking deck on which the vehicle is parked using the inclination pulse.
    Type: Application
    Filed: June 6, 2023
    Publication date: May 23, 2024
    Inventors: Tae Young Heo, Nam Chung Paik, Kyu Nam Choi, Ja Ho Koo, Jung Eun Lee, Seung Eun Kim, Seung Woo Ha
  • Patent number: 7172725
    Abstract: In W—Cu alloy having a homogeneous micro-structure and a fabrication method thereof, the method includes forming mixed powders by mixing tungsten powders with W—Cu composite powders; forming a compact by pressurizing-forming the mixed powders; forming a skeleton by sintering the compact; and contacting copper to the skeleton and performing infiltration. W—Cu alloy having a homogeneous structure fabricated by the present invention shows better performance by being used as a material for high voltage electric contact of a contact braker, a material for heat sink of an IC semiconductor and a shaped charge liner.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: February 6, 2007
    Assignee: Agency For Defense Development
    Inventors: Moon-Hee Hong, Ja-Ho Choi, Seoung Lee, Eun-Pyo Kim, Sung-Ho Lee, Joon-Woong Noh
  • Publication number: 20040120840
    Abstract: In W-Cu alloy having a homogeneous micro-structure and a fabrication method thereof, the method includes forming mixed powders by mixing tungsten powders with W-Cu composite powders; forming a compact by pressurizing-forming the mixed powders; forming a skeleton by sintering the compact; and contacting copper to the skeleton and performing infiltration. W-Cu alloy having a homogeneous structure fabricated by the present invention shows better performance by being used as a material for high voltage electric contact of a contact braker, a material for heat sink of an IC semiconductor and a shaped charge liner.
    Type: Application
    Filed: November 28, 2003
    Publication date: June 24, 2004
    Applicant: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Moon-Hee Hong, Ja-Ho Choi, Seoung Lee, Eun-Pyo Kim, Sung-Ho Lee, Joon-Woong Noh