Patents by Inventor Ja-Hun Byeon

Ja-Hun Byeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117084
    Abstract: A curable composition is provided. The curable composition can eliminate or minimize the generation of bubbles inside the cured product after the initiation reaction of the curable monomer, prevent expansion of a material when used to encapsulate a device, and provide a uniform cured product to solve the problem of separation between the upper and lower substrates bonded together, thereby improving device encapsulation performance.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 11, 2024
    Inventors: Young Jin KWON, Seong Chan SON, Jin Wuk KIM, Dong Min KIM, Ja Hun BYEON
  • Patent number: 9460826
    Abstract: The present invention relates to a conductive composition for forming a back electrode of a liquid crystal device, and a formation method of a back electrode using the same. The conductive composition enables the supply of a back electrode having excellent coating uniformity, low surface resistance, high transmittance and surface hardness, and particularly excellent reliability of 500 hours.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: October 4, 2016
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Ja Hun Byeon, Dong Min Kim, Won-Young Lee, Eun Jeagal, Seung-Ki Kim, Woo Sung Hong, Jung Yul Lee, You-Young Kim
  • Publication number: 20140326927
    Abstract: The present invention relates to a conductive composition for forming a back electrode of a liquid crystal device, and a formation method of a back electrode using the same. The conductive composition enables the supply of a back electrode having excellent coating uniformity, low surface resistance, high transmittance and surface hardness, and particularly excellent reliability of 500 hours.
    Type: Application
    Filed: December 3, 2012
    Publication date: November 6, 2014
    Inventors: Ja Hun Byeon, Dong Min Kim, Won-Young Lee, Eun Jeagal, Seung-Ki Kim, Woo Sung Hong, Jung Yul Lee, You-Young Kim
  • Patent number: 8790859
    Abstract: The present invention relates to a photoresist composition for digital exposure and a method of fabricating a thin film transistor substrate. The photoresist composition for digital exposure includes a binder resin including a novolak resin and a compound represented by the chemical formula (1), a photosensitizer including a diazide-based compound, and a solvent: wherein R1-R9 each include a hydrogen atom, an alkyl group, or a benzyl group, a is an integer from 0 to 10, b is an integer from 0 to 100, and c is an integer from 0 to 10.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: July 29, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang-Hyun Yun, Woo-Seok Jeon, Jung-In Park, Hi-Kuk Lee, Byung-Uk Kim, Dong-Min Kim, Seung-Ki Kim, Ja-Hun Byeon
  • Publication number: 20100167476
    Abstract: The present invention relates to a photoresist composition for digital exposure and a method of fabricating a thin film transistor substrate. The photoresist composition for digital exposure includes a binder resin including a novolak resin and a compound represented by the chemical formula (1), a photosensitizer including a diazide-based compound, and a solvent: wherein R1-R9 each include a hydrogen atom, an alkyl group, or a benzyl group, a is an integer from 0 to 10, b is an integer from 0 to 100, and c is an integer from 0 to 10.
    Type: Application
    Filed: November 18, 2009
    Publication date: July 1, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hyun Yun, Wook-Seok Jeon, Jung-In Park, Hi-Kuk Lee, Byung-Uk Kim, Dong-Min Kim, Seung-Ki Kim, Ja-Hun Byeon