Abstract: Wire bondable connectors assembly 10 is provided, including a lead element 12 have a lead portion 14 and a carrier strip portion 16, a first coining area 20 and a second coining area 22 formed in the lead element 12, and a connector housing 18 molded to the lead portion 14, including a fence element 24 surrounding the first coining area 20. In this fashion, the carrier strip portion 16 may be separated from the lead portion 14 in the location of the second coining area 22 while leaving the lead portion 14 secure within the connector housing 18.

Abstract: An apparatus for dampening movement of passivation material in an electronic module and a method for manufacturing an electronic module incorporating such an apparatus are disclosed. The apparatus includes a housing defining a cavity sized to contain an electrical circuit and a non-solid passivation material. The apparatus further includes means for limiting movement of the passivation material within the cavity in at least one direction. In a preferred embodiment, the limiting means comprises at least one dam.