Abstract: The present invention involves a rain shield assembly for a package air conditioner and heat pump unit. A cover is pivotally mounted to the package unit housing and has a sealing pad made of a resilient foam material. When the cover is moved to a sealing position, the foam pad contacts foam sealing strips that are attached to the unit housing and that separately ring access openings provided in the housing. Electrical circuitry such as circuit breakers may port through these access openings. Cavities are provided in the sealing pad in alignment with the access openings to accommodate projecting handles or switches of the electrical circuitry. The contact between the sealing pad and the sealing strips forms water-tight seals around the portion of the electrical circuitry projecting from the package unit housing so as to protect the circuitry from potentially damaging exposure to the elements.