Patents by Inventor Jack C. Loessi

Jack C. Loessi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4749362
    Abstract: A connector clip, particularly useful in testing a dual in-line packaged (DIP) integrated circuit (IC), comprising a plurality of connector elements which are in contact with and serve to extend corresponding terminals of the IC, wherein at least one connector element includes a resistance which prevents damage to the IC or such other circuit in the event that connector elements are inadvertently short-circuited.
    Type: Grant
    Filed: April 11, 1983
    Date of Patent: June 7, 1988
    Assignee: The Johns Hopkins University
    Inventors: Eric J. Hoffman, Jack C. Loessi