Abstract: In a probe head for an automatic semiconductive wafer prober, the probe head includes a probe body means for coupling the probe head to the probe holder surrounding a chuck which carries the wafer. The chuck is moveable in the plane of the wafer (horizontal) and orthogonal to the plane of the wafer (vertical) for sequentially moving a pattern of probe heads into testing engagement with corresponding patterns of test points on the wafer under test. The probe head includes a testing head having a probe portion (blade, needle or point) for making electrical contact with a respective test point on the wafer. The test head is coupled to the probe body by means of a way for guiding the initial vertical adjustable movement of the testing head in the vertical direction, whereas the probe body is pivotably and slideably coupled to the probe holder so as to permit a second initial adjustment of the probe body in the horizontal plane for establishing the test probe pattern.