Patents by Inventor Jack Howard Linn

Jack Howard Linn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitor structure in a bonded wafer and method of fabrication
    Patent number: 5841182
    Abstract: A bonded wafer structure has a device wafer 18 bonded to a handle wafer 10. A capacitor including a bottom plate as the surface 11 of handle wafer 10, a dielectric layer 12 and a top plate 15 is embedded in the bonded structure. A contact trench 22 extends from the surface 8 of device wafer 18 to the top plate 15 of the embedded capacitor.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: November 24, 1998
    Assignee: Harris Corporation
    Inventors: Jack Howard Linn, Gregg Douglas Croft