Abstract: A removable gasket for sealing an air-cooled hollow core module to the port of a chassis plenum for supplying cooling air includes an aluminum frame to which a thermally conductive elastomer seal is vulcanized. The gasket frame provides support for the seal and serves as a compression limiting stop for the seal. The gasket is held in alignment with the cooling channel of the hollow core module with attachment screws, greatly facilitating the gasket removal and repair of the module, and realignment with the chassis plenum port upon reassembly.

Abstract: A very high density, multiple contact connector has low-inductance power and ground planes and gold dot contacts for providing a controlled impedance environment to a module assembly by minimizing undesirable effects such as ground-noise and reflections while assuring operation at interconnect bandwidths up to 6 GHz. The controlled impedance connector connects two printed wiring boards (PWBs) comprising surface mounted devices to a motherboard. The PWBs are bonded to opposite sides of a central heat frame. The connector has two flexible circuits containing a total of 460 gold dot signal connections plus a plurality of separate gold dot power and ground connections. Signal runs between the PWBs and the connector flexible circuits are interconnected using copper fingers soldered to pads on the PWBs. Power and ground planes connect to the PWBs via gold dot contacts on the inside of the flexible circuit surface to pads on the PWBs. The connector is a true zero insertion force design.