Patents by Inventor Jack L. Dais

Jack L. Dais has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic RF or thermal shield for automatic vacuum placement
    Patent number: 5530202
    Abstract: A metallic RF or thermal shield (200, 200', 200") has a non-perforated area (202) around its center of mass, of a radius (203) sufficient for pick-up and placement of the shield by automatic vacuum pick-up equipment during automated surface-mount circuit assembly.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: June 25, 1996
    Assignee: AT&T Corp.
    Inventors: Jack L. Dais, Khalil N. Nikmanesh