Patents by Inventor Jack Lai

Jack Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070023306
    Abstract: A hex wrench storage device includes a body having a first face and a second face opposite to the first face. The first face forms a plurality of receiving recesses having different width for receiving a plurality of hex wrenches having different sizes. The hex wrench storage device further includes a plurality of press devices mounted on the receiving recesses so that the hex wrenches are positioned in the receiving recesses without falling.
    Type: Application
    Filed: July 26, 2005
    Publication date: February 1, 2007
    Applicant: JACO INTERNATIONAL CORPORATION
    Inventor: Jack Lai
  • Publication number: 20050134854
    Abstract: A rotary spectrometer including a plurality of input ports. Each input port may be arranged to receive an optical waveguide carrying electromagnetic radiation. The spectrometer also includes a plurality of optical bandpass filters, which are housed on a first body that rotates under the control of a motor so that each optical bandpass filter may be brought into alignment with each input port. Further, the spectrometer includes a plurality of detector circuits disposed on a second body that rotates with the first body. Each detector circuit is optoelectrically coupled to one of the plurality of optical bandpass filters, thereby resulting in each detector circuit being dedicated to responding to a range of wavelengths determined by the bandpass filter to which it is optoelectrically coupled.
    Type: Application
    Filed: December 19, 2003
    Publication date: June 23, 2005
    Inventors: Francis Aguirre, Jack Lai
  • Publication number: 20050116179
    Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
    Type: Application
    Filed: June 16, 2004
    Publication date: June 2, 2005
    Inventors: Francis Aguirre, Michele Craton, Jack Lai, David Phillips, Peter Benson, Dave Hofeldt
  • Publication number: 20050116178
    Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
    Type: Application
    Filed: June 16, 2004
    Publication date: June 2, 2005
    Inventors: Francis Aguirre, Peter Benson, Michele Craton, David Hofeldt, Jack Lai, David Phillips
  • Publication number: 20050116176
    Abstract: A radiation curing apparatus comprises a plurality of solid state radiation sources to generate radiation that cures a first material. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The curing apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 2, 2005
    Inventors: Francis Aguirre, Michele Craton, Jack Lai, David Phillips, Peter Benson, Gordon Henson, Michael Meis
  • Publication number: 20050116177
    Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
    Type: Application
    Filed: June 16, 2004
    Publication date: June 2, 2005
    Inventors: Francis Aguirre, Michele Craton, Jack Lai, David Phillips, Peter Benson
  • Patent number: 5976199
    Abstract: A manufacturing system for individually processing semiconductor wafers through a plurality of processing stations. The system has a plurality of processing stations, a multilevel track system that interfaces with the processing stations, and guided transport vehicles that operate on the track system to move individual wafers in wafer carriers between the stations. The carriers have a storage memory that contains the required process sequence and the capability to remember the completed process steps.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: November 2, 1999
    Assignee: United Microelectronics Corp.
    Inventors: Hong-Jen Wu, Taylor Chen, Jack Lai, I. I. Chen
  • Patent number: 5668056
    Abstract: A manufacturing system for individually processing semiconductor wafers through a plurality of processing stations. The system has a plurality of processing stations, a multilevel track system that interfaces with the processing stations, and guided transport vehicles that operate on the track system to move individual wafers in wafer carriers between the stations. The carriers have a storage memory that contains the required process sequence and the capability to remember the completed process steps.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: September 16, 1997
    Assignee: United Microelectronics Corporation
    Inventors: Hong Jen Wu, Taylor Chen, Jack Lai, I. I. Chen