Abstract: A solderless filter assembly wherein a filter in the form of a sleeve having a hollow bore extending therethrough is placed in electrical contact with a mounting body positioned therearound and an electrically conductive pin passing through the bore of the filter without requirement of solder. This is accomplished by providing an internal spring positioned around the pin and having convex tines thereon which provide a pressure fit with the internal diameter of the filter sleeve and is frictionally locked onto the pin. A second spring having concave tines is positioned around the outer diameter of the filter sleeve and provides a pressure fit therewith, the outer spring also making electrical contact with the shell or mounting body surrounding the filter. The filter sleeve and spring members are isolated from the external environment by pot stops which are positioned within cut out regions of the mounting body.

Abstract: The disclosure relates to a filter module which is self groundable when mounted on a printed circuit board. The filter modules include a pair of ground planes mounted normal to each other and each secured to the ground sleeves of the filters and also to a ground plane on the printed circuit board.