Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid.

Abstract: Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

Abstract: Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

Abstract: Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.