Abstract: A slide assembly adapted for use with a projector body, having a projector body, having a light source, an optical system and a chamber in which an image forming element can be placed. The slide assembly has a housing adapted to be positioned over the slide projector body with an active matrix display slide movably mounted to housing with a storage position in the housing and an operating position outside the housing. In the operating position the display slide is positioned in a slide projector chamber for projection of an image onto an external viewing surface.

Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.

Abstract: The improved zone-melt recrystallization apparatus is comprised of a heating element having a plurality of individually controllable heating elements. The elements are heated in sequence to generate a melted zone within a semiconductor material which is translated across the material by heating then cooling adjacent heating elements to recrystallize the material.

Abstract: An monolithic integrated transceiver formed on an Si substrate comprising: a III-V compound light source, a III-V compound light detector and a pyramidal groove formed in the substrate for aligning an optical fiber with said transmitter.

Abstract: A GaAs containing nucleation layer is deposited upon Si, Ge/Si, or other single crystal substrate from triethyl gallium (TEG). Deposition from TEG allows a lower deposition temperature which provides a low level of substrate contamination and improved surface morphology.

Abstract: An optical device formed on an Si substrate comprising: a III-V optical transmitter formed on the Si substrate, a silicon device formed in or on, the Si substrate and an alignment groove formed in the substrate for aligning an optical fiber with said transmitter.

Abstract: A method of OMCVD heteroepitaxy of III/V (GaAs) material on a patterned Si substrate is described wherein heteroepitaxy deposition occurs only on the exposed Si surfaces and nowhere else.

Abstract: A method of compensating grain boundaries or dislocations causing interstices to form particularly in polycrystalline semiconductor materials is disclosed which comprises selectively diffusing opposite impurity-type donor semiconductor material into the interstice to thereby reduce the conductivity of the interstice.