Patents by Inventor Jack V. Ajoian

Jack V. Ajoian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180124917
    Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 3, 2018
    Inventor: Jack V. Ajoian
  • Patent number: 9860985
    Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: January 2, 2018
    Assignee: Lockheed Martin Corporation
    Inventor: Jack V. Ajoian
  • Patent number: 9609752
    Abstract: An interconnect structure and method for manufacturing the same includes a substrate and a copper trace line defined on a surface of the substrate. The copper trace line includes a transmission line and a contact pad. The copper trace line is plated with a layer of metal which will oxidize if exposed to the atmosphere. The layer of metal is further plated with a layer of gold. The gold layer is selectively applied to the transmission line and the contact pad to define a gap on the transmission line at the contact pad. The metal layer is exposed in the gap. An oxide layer is formed on the metal layer in the gap. The oxide layer and the substrate surround the contact pad define a barrier to spread of solder.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: March 28, 2017
    Assignee: Lockheed Martin Corporation
    Inventors: Daniel L. Blass, Jack V. Ajoian
  • Patent number: 8269592
    Abstract: A transformer includes a magnetic core through which an insulated electrical first conductor extends to define a turn of winding. The first conductor is tubular, in that it defines a generally axial aperture. A plurality of electrically insulated conductive windings are twisted together to form a bundle, or a pair if only two. The bundle extends through the axial aperture, to define at least an additional turn of winding. The individual conductors of the bundle are stripped of insulation at locations without the aperture of the first conductor.
    Type: Grant
    Filed: May 5, 2010
    Date of Patent: September 18, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Daniel H. McCauley, IV, Richard J. Heinrich, Thomas V. Benevides, Jack V. Ajoian