Patents by Inventor Jack W. Helzer

Jack W. Helzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230042919
    Abstract: A chemical liquid manufacturing apparatus is provided. The manufacturing apparatus at least includes an ion exchange medium and an ion adsorption medium configured downstream from the ion exchange medium. A material of the ion adsorption medium includes a resin material having an amide bond or an imide bond.
    Type: Application
    Filed: October 7, 2022
    Publication date: February 9, 2023
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Yuan Chen, Jack W. Helzer, Pejman Ahmadiannamini
  • Patent number: 11498033
    Abstract: A chemical liquid manufacturing apparatus is provided. The manufacturing apparatus at least includes an ion exchange medium and an ion adsorption medium configured downstream from the ion exchange medium. A material of the ion adsorption medium includes a resin material having an amide bond or an imide bond. A manufacturing method of a chemical liquid using the apparatus is also provided.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 15, 2022
    Assignee: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Yuan Chen, Jack W. Helzer, Pejman Ahmadiannamini
  • Publication number: 20200156013
    Abstract: A chemical liquid manufacturing apparatus is provided. The manufacturing apparatus at least includes an ion exchange medium and an ion adsorption medium configured downstream from the ion exchange medium. A material of the ion adsorption medium includes a resin material having an amide bond or an imide bond. A manufacturing method of a chemical liquid using the apparatus is also provided.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 21, 2020
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Yuan Chen, Jack W. Helzer, Pejman Ahmadiannamini