Abstract: An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. Wherein the upper metal sheets are shorter than that of the lower metal sheets, so the upper surface of the lower metal sheets are exposed from the encapsulant. A photosensitive chip arranged within the chamber, plural wires are for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract: A small memory card includes a first substrate, a heat sink, a second substrate, at least one upper memory chip, at least one bottom memory chip and a glue layer. The heat sink is arranged between the first substrate and second substrate, and contacted with the metal, which are filled within the plurality of through holes, which formed between the first substrate and second substrate. And each of the upper memory chips and bottom memory chips are mounted on the first substrate and the second substrate, so that the heat of the upper and bottom memory chips may be traveled to the heat sink via the metal, which is filled within the through hole, then the heat will be dispersed. Thus, the small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively, the manufacturing processes must be simplified and the manufacturing cost must decrease also.

Abstract: A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

Abstract: An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.

Abstract: A substrate structure for an integrated circuit package to be electrically connected to a printed circuit board. The substrate structure includes a plurality of lower metal sheets arranged in an array, a plurality of upper metal sheets arranged in an array, and an encapsulant for encapsulating the lower metal sheets and the upper metal sheets. Each of the lower metal sheets has an upper surface and a lower surface. Each of the upper metal sheets has an upper surface and a lower surface, and the lower surfaces of the upper metal sheets are stacked on the upper surfaces of the lower metal sheets. The upper surfaces of the upper metal sheets are exposed from the encapsulant, and the lower surfaces of the lower metal sheets are exposed from the encapsulant and electrically connected to the printed circuit board.

Abstract: An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut-corners.

Abstract: An image sensor module includes an image sensor, and a lens holder and a lens barrel on the image sensor. The image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract: An image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract: An image sensor includes lower and upper metal sheet sets, an encapsulant, a photosensitive chip, wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a middle board among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets stacked on the lower metal sheets, respectively. The encapsulant encapsulates the upper and lower metal sheets and the middle board with upper surfaces of the upper sheets, lower surfaces of the lower sheets, and upper and lower surfaces of the middle board exposed from the encapsulant, and with a frame layer formed around the upper sheets to define a chamber. The chip is mounted to the middle board and located within the chamber. The wires electrically connect the chip to the upper metal sheets. The transparent layer is arranged on the frame layer to cover the chip.

Abstract: An image sensor includes a lower metal sheet set, an upper metal sheet set, an encapsulant, a photosensitive chip, plural wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a lower middle board arranged among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets and an upper middle board arranged among and flush with the upper metal sheets. The encapsulant encapsulates the lower metal sheets, lower middle board, upper metal sheets and upper middle board with the upper metal sheets, lower metal sheets, lower middle board, and upper middle board exposed from the encapsulant, and with a frame layer formed around the upper metal sheets to define a chamber. The photosensitive chip is arranged on the upper surface of the upper middle board and located within the chamber.

Abstract: An image sensor package includes a plurality of leadframes, a molded resin, a photosensitive, a plurality of wires and a transparent layer. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. The molded resin is for encapsulating the leadframes, and is forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin. The photosensitive chip is mounted onto the upper surface of the molded resin and arranged within the chamber. Each of wires are electrically connected the photosensitive chip to the each second board of the plurality of leadframes. And the transparent resin is covered onto the each first board of the plurality of leadframes.

Abstract: A memory card for being electrically connected to an electrical device. The memory card includes a substrate, and at least one memory chip. The substrate is formed with a plurality of contact leads, which is electrically connected to the electrical device when the substrate is inserted into the electrical device. The plurality of contact leads includes a long contact lead and a short contact lead to indicate an inserting direction of the substrate into the electrical device. The memory chip is mounted to the substrate and electrically connected to the plurality of contact leads.

Abstract: A substrate structure for a photosensitive chip package includes a plurality of leadframes, which are arranged in a matrix, and a molded resin. Each of the leadframes have a first board and a second board located on a height different from that of the first board, and a chamber is defined upper a central of the plurality of leadframes. And the molded resin is for encapsulating the leadframes, and forming an upper surface and a lower surface, wherein the first boards of the leadframes are exposed from the upper surface of the molded resin.

Abstract: A wire bonding capillary includes a first column having a first end and a second end, a second column extending from the second end of the first column and having a circular cross-section with a diameter smaller than that of the first column, and a third column extending from the second column and formed with a funnel structure and a pointed wire-bonding end. The third column is positioned between a frame layer and a photosensitive chip of an image sensor to bond a plurality of wires to a photosensitive chip and a substrate of the image sensor.

Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip, and a transparent layer. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The frame layer has a first surface and a second surface and is mounted to the upper surface of the substrate with the first surface of the frame layer contacting the upper surface of the substrate so as to form a cavity together with the substrate. The second surface is formed with a rough contact surface. The photosensitive chip is mounted to the upper surface of the substrate and located within the cavity and is electrically connected to the first connection points of the substrate. The transparent layer is adhered to the rough contact surface.

Abstract: An apparatus for removing an image sensor from a printed circuit board. The apparatus includes a hot-air nozzle for producing hot air and a hot-air tube connected to the hot-air nozzle to transfer the hot air produced by the hot-air nozzle. The hot-air tube surrounds the image sensor and is formed with a plurality of outlets for outputting the hot air toward the image sensor so as to melt the solder.

Abstract: A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is formed with a plurality of bonding pads, to the upper surface of the substrate, the photosensitive chip being located within the cavity; providing a plurality of wires to electrically connect the bonding pads of the photosensitive chip to the substrate; supplying an adhesive medium to the cavity; placing a transparent layer on the frame layer to cover the photosensitive chip so as to form the image sensor; and rotating the image sensor to make the adhesive medium uniformly distributed over the upper surface of the substrate so that particles within the cavity may fall to the adhesive medium.

Abstract: A simplified image sensor module includes a substrate, a photosensitive chip, a plurality of wires, and transparent glue. The substrate has an upper surface formed with a plurality of first connection points, and a lower surface formed with a plurality of second connection points. The photosensitive chip has a plurality of bonding pads and is mounted to the upper surface of the substrate. The wires electrically connect the bonding pads of the photosensitive chip to the first connection points of the substrate, respectively. The transparent glue is arranged on the upper surface of the substrate to encapsulate the photosensitive chip and is formed with a convex portion corresponding to the photosensitive chip. The photosensitive chip may receive focused optical signals focused by the convex portion of the transparent glue.

Abstract: A simplified image sensor module includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and transparent glue. The substrate has an upper surface and a lower surface. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is mounted to the upper surface of the substrate and is located within the cavity. The wires electrically connect bonding pads of the photosensitive chip to the substrate. The transparent glue is filled in the cavity to encapsulate the photosensitive chip and is formed with a convex portion corresponding to the photosensitive chip. Therefore, the photosensitive chip may receive focused optical signals focused by the convex portion of the transparent glue.