Patents by Inventor Jacob Alan Hubbell
Jacob Alan Hubbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11264871Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.Type: GrantFiled: October 11, 2019Date of Patent: March 1, 2022Assignee: Transportation IP Holdings, LLCInventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
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Patent number: 10819087Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.Type: GrantFiled: July 31, 2019Date of Patent: October 27, 2020Assignee: GE GLOBAL SOURCING LLCInventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle
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Publication number: 20200044519Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.Type: ApplicationFiled: October 11, 2019Publication date: February 6, 2020Inventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
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Publication number: 20190356116Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.Type: ApplicationFiled: July 31, 2019Publication date: November 21, 2019Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle
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Patent number: 10454349Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.Type: GrantFiled: April 15, 2015Date of Patent: October 22, 2019Assignee: GE GLOBAL SOURCING LLCInventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
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Patent number: 10384548Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.Type: GrantFiled: April 28, 2016Date of Patent: August 20, 2019Assignee: GE GLOBAL SOURCING LLCInventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolaev Nikolov
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Publication number: 20170313196Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.Type: ApplicationFiled: April 28, 2016Publication date: November 2, 2017Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolaev Nikolov
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Publication number: 20160308455Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.Type: ApplicationFiled: April 15, 2015Publication date: October 20, 2016Inventors: Sarit RATADIYA, Jacob Alan HUBBELL, Ajith Kuttannair KUMAR, Mark MURPHY, Shreenath Shekar PERLAGURI
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Patent number: D760658Type: GrantFiled: April 20, 2015Date of Patent: July 5, 2016Assignee: General Electric CompanyInventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil, Jacob Alan Hubbell
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Patent number: D784265Type: GrantFiled: May 26, 2016Date of Patent: April 18, 2017Assignee: General Electric CompanyInventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
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Patent number: D806039Type: GrantFiled: December 2, 2016Date of Patent: December 26, 2017Assignee: General Electric CompanyInventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
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Patent number: D834530Type: GrantFiled: November 14, 2017Date of Patent: November 27, 2018Assignee: General Electric CompanyInventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil
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Patent number: D848955Type: GrantFiled: October 26, 2018Date of Patent: May 21, 2019Assignee: GE Global Sourcing LLCInventors: Shreenath Shekar Perlaguri, Sarit Ratadiya, Jacob Alan Hubbell, Mark Allen Murphy, Jain Raj Vettuvazhy Puthenpurayil