Patents by Inventor Jacob C. Chang

Jacob C. Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Increasing thermal isolation of a probe card assembly
    Patent number: 8324915
    Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: December 4, 2012
    Assignee: FormFactor, Inc.
    Inventors: Kevin Y. Yasumura, Timothy Blomgren, Jacob C. Chang, Michael W. Huebner
  • INCREASING THERMAL ISOLATION OF A PROBE CARD ASSEMBLY
    Publication number: 20090230981
    Abstract: A probe card assembly can include an electrical interface to a test system for testing electronic devices such as semiconductor dies. The probe card assembly can also include probes located at a first side of the probe card assembly. The probes, which can be electrically connected to the electrical interface, can be configured to contact terminals of the electronic devices in the test system while the probe card assembly is attached to the test system. The probe card assembly can be configured to impede thermal flow from the probe card assembly to the test system at places of physical contact between the probe card assembly and the test system while the probe card assembly is attached to the test system.
    Type: Application
    Filed: November 21, 2008
    Publication date: September 17, 2009
    Inventors: Kevin Y. Yasumura, Timothy Blomgren, Jacob C. Chang, Michael W. Huebner