Patents by Inventor Jacob Lee Hiester
Jacob Lee Hiester has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230272533Abstract: In some examples, an automated tilting system is provided for adjusting an orientation of a component in a substrate processing chamber. The automated tilting system comprises at least one tilt adjustment motor arranged to cooperate with the component and be connected to a portion of the component by a coupling. The coupling is configured such that automated rotational motion by the at least one tilt adjustment motor imparts corresponding axial movement, relative to the at least one tilt adjustment motor or a datum structure, to the connected portion of the component to adjust the orientation of the component in the processing chamber.Type: ApplicationFiled: June 10, 2021Publication date: August 31, 2023Inventors: Sam Jafarian Tehrani, Bryan Anthony Cmelak, Jacob Lee Hiester, Bin Luo, John Wiltse
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Publication number: 20230088715Abstract: A pedestal assembly including a pedestal for supporting a substrate. A central shaft positions the pedestal at a height during operation. A ring is placed along a periphery of the pedestal. A ring adjuster subassembly includes an adjuster flange disposed around a middle section of the central shaft. The subassembly includes a sleeve connected to the adjuster flange and extending from the adjuster flange to an adjuster plate disposed under the pedestal. The subassembly includes ring adjuster pins connected to the adjuster plate and extending vertically from the adjuster plate. Each of the ring adjuster pins being positioned on the adjuster plate at locations adjacent to and outside of a pedestal diameter. The ring adjuster pins contacting an edge undersurface of the ring. The adjuster flange coupled to at least three adjuster actuators for defining an elevation and tilt of the ring relative to a top surface of the pedestal.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Inventors: Jacob Lee Hiester, Richard M. Blank, Curtis W. Bailey, Michael J. Janicki
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Patent number: 11512393Abstract: A pedestal assembly including a pedestal for supporting a substrate. A central shaft positions the pedestal at a height during operation. A ring is placed along a periphery of the pedestal. A ring adjuster subassembly includes an adjuster flange disposed around a middle section of the central shaft. The subassembly includes a sleeve connected to the adjuster flange and extending from the adjuster flange to an adjuster plate disposed under the pedestal. The subassembly includes ring adjuster pins connected to the adjuster plate and extending vertically from the adjuster plate. Each of the ring adjuster pins being positioned on the adjuster plate at locations adjacent to and outside of a pedestal diameter. The ring adjuster pins contacting an edge undersurface of the ring. The adjuster flange coupled to at least three adjuster actuators for defining an elevation and tilt of the ring relative to a top surface of the pedestal.Type: GrantFiled: November 29, 2018Date of Patent: November 29, 2022Assignee: Lam Research CorporationInventors: Jacob Lee Hiester, Richard M. Blank, Curtis W. Bailey, Michael J. Janicki
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Publication number: 20200173018Abstract: A pedestal assembly including a pedestal for supporting a substrate. A central shaft positions the pedestal at a height during operation. A ring is placed along a periphery of the pedestal. A ring adjuster subassembly includes an adjuster flange disposed around a middle section of the central shaft. The subassembly includes a sleeve connected to the adjuster flange and extending from the adjuster flange to an adjuster plate disposed under the pedestal. The subassembly includes ring adjuster pins connected to the adjuster plate and extending vertically from the adjuster plate. Each of the ring adjuster pins being positioned on the adjuster plate at locations adjacent to and outside of a pedestal diameter. The ring adjuster pins contacting an edge undersurface of the ring. The adjuster flange coupled to at least three adjuster actuators for defining an elevation and tilt of the ring relative to a top surface of the pedestal.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventors: Jacob Lee Hiester, Richard M. Blank, Curtis W. Bailey, Michael J. Janicki
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Patent number: 10233556Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. Also typically present is an edge flow element configured to direct electrolyte into a corner formed between the substrate and substrate holder. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet.Type: GrantFiled: May 20, 2016Date of Patent: March 19, 2019Assignee: Lam Research CorporationInventors: Gabriel Hay Graham, Jacob Lee Hiester, Lee Peng Chua, Bryan L. Buckalew
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Publication number: 20170342590Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.Type: ApplicationFiled: January 23, 2017Publication date: November 30, 2017Inventors: Kari Thorkelsson, Jacob Lee Hiester, Yu Ding, Bryan L. Buckalew
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Publication number: 20160265132Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. Also typically present is an edge flow element configured to direct electrolyte into a corner formed between the substrate and substrate holder. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet.Type: ApplicationFiled: May 20, 2016Publication date: September 15, 2016Inventors: Gabriel Hay Graham, Jacob Lee Hiester, Lee Peng Chua, Bryan L. Buckalew
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Patent number: 9349629Abstract: Methods and systems for the touch auto-calibration for robot placement of substrate in process modules are provided. Touch auto-calibration allows for the automatic calibration of robot end effector positioning with respect to an aligning base in a process module. Touch auto-calibration also allows for calibration of process modules at temperatures and pressures similar to the temperatures and pressures experienced during production. The end effector has one or more aligning surfaces configured to align it with the aligning base upon contact with the aligning base. After contact, the position of the end effector and the calibrated position of the end effector during a pick or place move can then be determined. In some implementations, the positioning of the end effector as it transfers a substrate during production is based on a placement coordinate with the placement correction applied.Type: GrantFiled: January 23, 2014Date of Patent: May 24, 2016Assignee: Lam Research CorporationInventors: Richard M. Blank, Peter S. Thaulad, Jacob Lee Hiester
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Publication number: 20150202774Abstract: Methods and systems for the touch auto-calibration for robot placement of substrate in process modules are provided. Touch auto-calibration allows for the automatic calibration of robot end effector positioning with respect to an aligning base in a process module. Touch auto-calibration also allows for calibration of process modules at temperatures and pressures similar to the temperatures and pressures experienced during production. The end effector has one or more aligning surfaces configured to align it with the aligning base upon contact with the aligning base. After contact, the position of the end effector and the calibrated position of the end effector during a pick or place move can then be determined. In some implementations, the positioning of the end effector as it transfers a substrate during production is based on a placement coordinate with the placement correction applied.Type: ApplicationFiled: January 23, 2014Publication date: July 23, 2015Applicant: Lam Research CorporationInventors: Richard M. Blank, Peter S. Thaulad, Jacob Lee Hiester