Abstract: An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die.

Abstract: A hay harvesting machine in which previously cut crop material in a windrow or swath on the ground is picked up and inverted to position a damp side up and a dry side down; as the crop is inverted, it is directed laterally toward one side of the machine and rearwardly; after inversion, the crop is turned further and conveyed for discharge back onto the ground laterally displaced from its original position on the ground.

Abstract: Apparatus for moving hay and turning it over from a first swath to a second swath, comprising a movable platform disposed in a substantially horizontal plane and having a generally semicircular shape, the platform having an upstanding curved wall on the outer edge of the curved side and rear portions thereof. A device is mounted on one side of the front portion of the platform for picking up hay in the first swath and depositing it on the adjacent portion of the platform as it is moved forwardly. A plurality of radially outwardly extending arms with depending tines are mounted on the platform for rotation in a substantially horizontal plane above the platform. The tines engage the hay deposited on the platform and move it along the platform in an arcuate path of approximately 180.degree. to the opposite side of the platform and over the front edge thereof to deposit the hay in an inverted position in a second swath laterally spaced from the first swath.

Abstract: An apparatus for laterally displacing and inverting a windrow of crop material is disclosed wherein a pickup engages a windrow of crop material along a first path and elevates the windrow into a table where it is conveyed in a semi-circular path by a horizontal conveyor until it is rolled off a discharge edge of the table into a second path laterally displaced from the first path. The speed relationship between the horizontal conveyor and the forward movement of the apparatus is such that the elevated windrow of crop material is gently rolled off the discharge edge of the platform in such a manner that the windrow is inverted when it engages the ground. A method of laterally displacing and inverting a windrow of crop material is also disclosed wherein the windrow is gently picked up, conveyed and turned upside down without the need for a structural device to engage the windrow and positively invert it.