Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.

Abstract: In one example, a heat pipe is configured to absorb and transfer heat away from ambient air of a data center to cool the ambient air circulating in the data center to cool devices of the data center, and a fluid interface is thermally coupled to the heat pipe and configured to cool the heat pipe via a coolant fluid circulating in the data center. In another example, a heat pipe configured to release transferred heat to air, and a fluid interface is thermally coupled to the heat pipe and configured to exchange heat to the heat pipe to cool a coolant fluid circulating in a data center to cool devices of the data center.

Abstract: A system includes a coolant reservoir, a coolant pump, and a heat exchanger. The coolant reservoir is at least in part included in a data center rack and configured to hold a coolant. The coolant pump is configured to pump the coolant to a manifold configured to distribute the coolant to a plurality of different rack mounted devices. The heat exchanger is configured to cool the coolant via an ambient air of a data center.

Abstract: Technology is provided for a component cooling system. The system can include a cooling block assembly and a radiator. The cooling block assembly includes a mounting bracket and a coolant block positioned in the mounting bracket. The coolant block includes a cold plate volume in fluid communication with an inlet plenum and an outlet plenum. A pump is positioned between the inlet plenum and the outlet plenum, coupled to the mounting bracket, and in fluid communication with the outlet plenum. The radiator includes a center tank having an inlet chamber in fluid communication with an outlet of the pump and an outlet chamber in fluid communication with the inlet plenum. A pair of end tanks are positioned on opposite sides of the center tank with core tubes extending between the inlet and outlet chambers and the pair of end tanks.

Abstract: The principles described herein provide a server device having a cooling system that provides an efficient cooling of server device components. The cooling system can include a radiator block having air passageways that are oriented substantially orthogonal to the initial airflow path direction. In addition, the server device can include one or more baffles that create an airflow path that passes through the radiator block multiple times. Moreover, the server device can include various additional features that provide convenient access to electronic components within the server device without diminishing the effectiveness of the cooling system.

Abstract: The principles described herein provide a server device having a cooling system that provides an efficient cooling of server device components. The cooling system can include a radiator block having air passageways that are oriented substantially orthogonal to the initial airflow path direction. In addition, the server device can include one or more baffles that create an airflow path that passes through the radiator block multiple times. Moreover, the server device can include various additional features that provide convenient access to electronic components within the server device without diminishing the effectiveness of the cooling system.