Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.

Abstract: A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in at least one layer of the IC that is susceptible to a process fault. Upon fabricating at least one layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in at least one layer responsively to the PDP.