Abstract: A method for preparing coated metal nanoparticles, each nanoparticle comprising a core constituted of at least one metal M and a layer constituted of at least one polymer, the layer coating the metal core. The method comprises the steps: (a1) preparing a solution A comprising the at least one metal M in the form of cations Mn+, n being an integer comprised between 1 and 3, each metal M being a transition metal of atomic number comprised between 21 and 30, a polyol, and a noble metal salt; (a2) preparing a solution B comprising at least one organic monomer of the at least one polymer, in an organic solvent; (b) mixing solutions A and B, this mixture being heated to the boiling temperature of the polyol; and (c) recovering the coated metal nanoparticles.

Abstract: A method for preparing coated metal nanoparticles, each nanoparticle comprising a core constituted of at least one metal M and a layer constituted of at least one polymer, the layer coating the metal core. The method comprises the steps: (a1) preparing a solution A comprising the at least one metal M in the form of cations Mn+, n being an integer comprised between 1 and 3, each metal M being a transition metal of atomic number comprised between 21 and 30, a polyol, and a noble metal salt; (a2) preparing a solution B comprising at least one organic monomer of the at least one polymer, in an organic solvent; (b) mixing solutions A and B, this mixture being heated to the boiling temperature of the polyol; and (c) recovering the coated metal nanoparticles.

Abstract: A method for producing a conductive area in a polymer material comprises: providing a polymer layer comprising conductive particles with a density such that the polymer layer is insulating, heating the polymer material to a temperature higher than or equal to the glass transition temperature of the polymer material, compressing a portion of the polymer layer using a stamp, in order to obtain a density of conductive particles such that the portion becomes conductive, and removing the stamp from the polymer layer.

Abstract: The invention relates to a method for displacing an object in a solid system involving the following steps: placing the object in a matrix which is solid at a first temperature and capable of softening due to the effect of a temperature increase; if necessary, increasing the temperature until the matrix softens; applying an external action to the object so as to move it inside the matrix; lowering the temperature until the matrix solidifies.

Abstract: A method for producing a conductive area in a polymer material comprises: providing a polymer layer comprising conductive particles with a density such that the polymer layer is insulating, heating the polymer material to a temperature higher than or equal to the glass transition temperature of the polymer material, compressing a portion of the polymer layer using a stamp, in order to obtain a density of conductive particles such that the portion becomes conductive, and removing the stamp from the polymer layer.

Abstract: A method for making an electric interconnection between two conducting layers, separated by at least one insulation or semi-conducting layer, which includes forming a stud extending between at least the lower conducting layer and the upper conducting layer, where the nature and/or the shape of the stud impart non-wettability properties relative to the material used for the separating layer.

Abstract: The invention relates to a method for displacing an object in a solid system involving the following steps: placing the object in a matrix which is solid at a first temperature and capable of softening due to the effect of a temperature increase; if necessary, increasing the temperature until the matrix softens; applying an external action to the object so as to move it inside the matrix; lowering the temperature until the matrix solidifies.

Abstract: The method of coating the area of hybridization of a component that is constituted by two elements bonded to one another by means of a soldering material, including depositing proximate to the component a coating substance capable of filling by capillarity action the volume defined between the hybridized elements of the component. Further, along the periphery of the hybridization area on the lower element of the component is an area of non-wettability in regards to the coating substance, that is defined by depositing an anti-wetting covering of PECVD in regards to the coating substance, whereby the anti-wetting covering on the first element encompasses the hybridization area and surrounds a wetting surface for the coating substance.

Abstract: This method for making an electric interconnection between two conducting layers separated by at least one insulation or semi-conducting layer, comprises forming a stud extending at least between the lower conducting layer and the upper conducting layer, wherein the nature and/or the shape of said stud impart non-wettability properties relative to the material used for the separating layer.

Abstract: This method of coating the area of hybridization of a component constituted by two elements associated with one another by means of a soldering material, comprises depositing in proximity to said component a coating substance capable of filling by capillarity the volume defined between the hybridized elements of said component. On the periphery of the hybridization area on the lower element of said component is defined an area (10) of non-wettability as regards said substance, by deposition of a covering anti-wetting as regards said substance, applied by PECVD, and defining on said first element, in line with the hybridization, a wetting surface for the coating substance.

Abstract: The invention relates to a method for eliminating mask projection laser ablation engraving defects from a metal film deposited on a flexible carrier. According to the invention, the method comprises spraying onto said defects a liquid pressurized at between about 1500 PSI and about 3000 PSI.

Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: The invention concerns a microstructure comprising an adhesive layer between a substrate and a photo-patternable layer, arranged on at least one face of the substrate. The adhesive layer is photosensitive and consists of a negative resin comprising at least one polymer of the family of elastomers and at least one photo-initiating component, in solution in an aromatic solvent. The photo-patternable layer consists of at least one negative epoxy resin. The method of fabrication of such a microstructure comprises spreading and drying the adhesive layer prior to depositing the photo-patternable layer. The adhesive layer can be exposed through a mask and developed, prior to the deposition of the photo-patternable layer.