Abstract: An aqueous cleaning composition having a pH of about 6 to about 8 and comprising a solution of the following ingredients: water, an organic solvent and an imidazoline-based cationic surfactant, each present in an amount effective to dissolve adherent soils from a substrate; and a nonionic surfactant in an amount sufficient to maintain said cationic surfactant in solution; and also a weak organic acid in an amount sufficient to impart to the composition said pH; wherein said composition is substantially free of any material which has an ozone-depletion factor of greater than about 0.15 and wherein said composition is substantially free of any material which would tend to form a solid with any of the ingredients comprising the composition, and its use to clean metallic and non-metallic surfaces.