Abstract: A circuit for measuring the dynamic characteristics of encapsulating packages for high-speed integrated circuits includes at least two amplifiers integrated on a semiconductor substrate. These amplifiers have the same input and output impedances as those of the high-speed circuit to be encapsulated within the package. The amplifiers are located in widely spaced relation in order to ensure that there is no internal coupling. Depending on the measurements to be performed, the two amplifiers are mounted in parallel or in antiparallel relation. In order to measure the dynamic characteristics of a package, a measuring circuit is mounted within a package and a signal (V.sub.e) is addressed to an input connection of the package. The transmission and coupling coefficients are deduced from measurement of the signal (V.sub.S) collected on an output connection.

Abstract: A circuit for measuring the dynamic characteristics of encapsulating packages for high-speed integrated circuits includes at least two amplifiers integrated on a semiconductor substrate. These amplifiers have the same input and output impedances as those of the high-speed circuit to be encapsulated within the package. The amplifiers are located in widely spaced relation in order to ensure that there is no internal coupling. Depending on the measurements to be performed, the two amplifiers are mounted in parallel or in antiparallel relation. In order to measure the dynamic characteristics of a package, a measuring circuit is mounted within a package and a signal (V.sub.e) is addressed to an input connection of the package. The transmission and coupling coefficients are deduced from measurement of the signal (V.sub.S) collected on an output connection.