Patents by Inventor Jae-Chang Lee
Jae-Chang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240137511Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.Type: ApplicationFiled: January 4, 2024Publication date: April 25, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Jin-Ho LEE, Jung-Won KANG, Hyunsuk KO, Sung-Chang LIM, Dong-San JUN, Ha-Hyun LEE, Seung-Hyun CHO, Hui-Yong KIM, Hae-Chul CHOI, Dae-Hyeok GWON, Jae-Gon KIM, A-Ram BACK
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Patent number: 11956426Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.Type: GrantFiled: May 9, 2022Date of Patent: April 9, 2024Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong UniversityInventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
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Patent number: 11943447Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus that perform inter-prediction using a motion vector predictor. For a candidate block in a col picture, a scaled motion vector is generated based on a motion vector of the candidate block. When the scaled motion vector indicates a target block, a motion vector predictor of the target block is generated based on the motion vector of the candidate block. The motion vector predictor is used to derive the motion vector of the target block in a specific inter-prediction mode such as a merge mode and an AMVP mode.Type: GrantFiled: July 13, 2022Date of Patent: March 26, 2024Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-ACADEMIA COOPERATION GROUP OF SEJONG UNIVERSITY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Sung-Chang Lim, Jung-Won Kang, Hyunsuk Ko, Jin-Ho Lee, Ha-Hyun Lee, Dong-San Jun, Hui-Yong Kim, Yung-Lyul Lee, Nam-Uk Kim, Jae-Gon Kim
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Publication number: 20240098302Abstract: Disclosed are a method for inducing a prediction motion vector and an apparatus using the same. An image decoding method can include: a step of determining the information related to a plurality of spatial candidate prediction motion vectors from peripheral predicted blocks of a predicted target block; and a step of determining the information related to temporal candidate prediction motion vectors on the basis of the information related to the plurality of spatial candidate prediction motion vectors. Accordingly, the present invention can reduce complexity and can enhance coding efficiency when inducing the optimum prediction motion vector.Type: ApplicationFiled: November 22, 2023Publication date: March 21, 2024Applicants: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace UniversityInventors: Sung Chang LIM, Hui Yong KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Jae Gon KIM, Sang Yong LEE, Un Ki PARK
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Publication number: 20240098275Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.Type: ApplicationFiled: November 15, 2023Publication date: March 21, 2024Inventors: Je Chang JEONG, Ki Baek KIM, Won Jin LEE, Hye Jin SHIN, Jong Sang YOO, Jang Hyeok YUN, Kyung Jun LEE, Jae Hun KIM, Sang Gu LEE
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Patent number: 11930179Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.Type: GrantFiled: December 27, 2019Date of Patent: March 12, 2024Assignees: Electronics and Telecommunications Research Institute, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNI, CHIPS & MEDIA, INC, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Jin Ho Lee, Hui Yong Kim, Yung Lyul Lee, Ji Yeon Jung, Nam Uk Kim, Myung Jun Kim, Yang Woo Kim, Dae Yeon Kim, Jae Gon Kim, Do Hyeon Park
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Patent number: 11917148Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.Type: GrantFiled: February 8, 2022Date of Patent: February 27, 2024Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation FoundationInventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
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Patent number: 11476832Abstract: A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.Type: GrantFiled: August 14, 2019Date of Patent: October 18, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook Park, Tae Kyung Lee, Seong Hun Na, Jae Chang Lee, Jae Hyun Jung
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Patent number: 11370698Abstract: Methods for coating a glass-based article, for example a cover glass, with a coating layer that is not deposited on the perimeter edge of the glass-based article. The methods may include direct patterning of a sacrificial material over a first region on a top surface the glass-based article but not a second region on the top surface of the glass-based article. The first region includes at least a portion of a perimeter edge of the glass-based article that is to be protected from deposition of the coating layer. After direct patterning of a sacrificial material and deposition of a coating layer, the sacrificial material may be removed such that the coating layer is disposed on the second region on the top surface of the glass-based article and not the first region. These methods may be used to make a glass-based article with non-edge-to-edge coating layers.Type: GrantFiled: October 31, 2017Date of Patent: June 28, 2022Assignee: Corning IncorporatedInventor: Jae-chang Lee
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Patent number: 11277113Abstract: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.Type: GrantFiled: July 23, 2020Date of Patent: March 15, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook Park, Jae Hyun Jung, Jae Chang Lee, Dae Hun Jeong, Sang Uk Son, Seong Hun Na
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Patent number: 11171096Abstract: A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.Type: GrantFiled: October 17, 2019Date of Patent: November 9, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook Park, Jae Chang Lee, Seong Hun Na, Jae Hyun Jung
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Publication number: 20210313954Abstract: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.Type: ApplicationFiled: July 23, 2020Publication date: October 7, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook PARK, Jae Hyun JUNG, Jae Chang LEE, Dae Hun JEONG, Sang Uk SON, Seong Hun NA
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Publication number: 20210035929Abstract: A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.Type: ApplicationFiled: October 17, 2019Publication date: February 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook PARK, Jae Chang LEE, Seong Hun NA, Jae Hyun JUNG
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Patent number: 10903816Abstract: A thin-film package includes: a substrate; a wiring layer disposed on the substrate; a microelectromechanical systems (MEMS) element disposed on a surface of the substrate; a partition wall disposed on the substrate to surround the MEMS element, and formed of a polymer material; a cap forming a cavity with the substrate and the partition wall; and an external connection electrode connected to the wiring layer. The external connection electrode includes at least one inclined portion disposed on at least one inclined surface formed on any one or any combination of any two or more of the substrate, the partition wall, and the cap.Type: GrantFiled: June 4, 2019Date of Patent: January 26, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook Park, Jae Chang Lee, Jae Hyun Jung, Seong Hun Na
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Patent number: 10836674Abstract: A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.Type: GrantFiled: March 21, 2018Date of Patent: November 17, 2020Assignee: Corning IncorporatedInventors: Michael Patrick Donovan, Jacob Immerman, Jenny Kim, Jae-Chang Lee
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Patent number: 10790797Abstract: An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.Type: GrantFiled: September 23, 2016Date of Patent: September 29, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Han, Moon Chul Lee, Jae Chang Lee, Sang Uk Son, Tae Hun Lee
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Patent number: 10756700Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.Type: GrantFiled: June 30, 2017Date of Patent: August 25, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Han, Jae Chang Lee, Won Han, Tae Yoon Kim, Jong Woon Kim, Tae Kyung Lee, Moon Chul Lee, Tae Hun Lee, Sung Min Cho, In Young Kang
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Publication number: 20200177155Abstract: A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.Type: ApplicationFiled: August 14, 2019Publication date: June 4, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook PARK, Tae Kyung LEE, Seong Hun NA, Jae Chang LEE, Jae Hyun JUNG
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Publication number: 20200144986Abstract: A thin-film package includes: a substrate; a wiring layer disposed on the substrate; a microelectromechanical systems (MEMS) element disposed on a surface of the substrate; a partition wall disposed on the substrate to surround the MEMS element, and formed of a polymer material; a cap forming a cavity with the substrate and the partition wall; and an external connection electrode connected to the wiring layer. The external connection electrode includes at least one inclined portion disposed on at least one inclined surface formed on any one or any combination of any two or more of the substrate, the partition wall, and the cap.Type: ApplicationFiled: June 4, 2019Publication date: May 7, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seung Wook PARK, Jae Chang LEE, Jae Hyun JUNG, Seong Hun NA
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Publication number: 20200048142Abstract: A carrier apparatus includes an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an outer edge extending across the thickness between the first major surface and the second major surface. The carrier apparatus includes a coating including a central portion disposed on the first major surface of the article and an outer exposed portion disposed on the outer edge of the article, and a gasket including a first surface contacting the coating. An outer interface between the first surface of the gasket and the coating defines an outer boundary isolating the central portion of the coating from the outer exposed portion of the coating. Methods of processing a carrier apparatus to remove at least a portion of the coating from the article are also provided.Type: ApplicationFiled: March 21, 2018Publication date: February 13, 2020Inventors: Michael Patrick DONOVAN, Jacob IMMERMAN, Jenny KIM, Jae-chang LEE