Patents by Inventor Jae-Chull Lee
Jae-Chull Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130263895Abstract: A portable cleaning system for a CVD reactor. The cleaning system comprises two components: (1) a stand-mounted gloved box assembly for mounting a flow flange or shower head of a CVD reactor thereto, and (2) a gloved device such as a gloved flange or gloved cylinder for mounting to the reactor chamber. Both components can be equipped with a filtration device for capturing particles that are cleaned out of the CVD reactor. Both systems can be purged with an inert gas to guard against pyrophoric reactions. The system can be used for cleaning existing CVD reactors without the need for costly modification of the CVD reactor to accommodate the cleaning equipment. Also, one cleaning system can be used to service several CVD reactors.Type: ApplicationFiled: April 6, 2012Publication date: October 10, 2013Inventors: Jae Chull Lee, Jong Hyuck Lee, Jae Min Lee, Jung Hun Lee
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Patent number: 8124907Abstract: Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.Type: GrantFiled: July 24, 2007Date of Patent: February 28, 2012Assignee: Applied Materials, Inc.Inventors: Jae-Chull Lee, Suhail Anwar, Shinichi Kurita
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Patent number: 8061949Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.Type: GrantFiled: February 22, 2010Date of Patent: November 22, 2011Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
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Patent number: 7845891Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.Type: GrantFiled: January 13, 2006Date of Patent: December 7, 2010Assignee: Applied Materials, Inc.Inventors: Jae-Chull Lee, Shinichi Kurita, John M. White, Suhail Anwar
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Patent number: 7845618Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.Type: GrantFiled: June 24, 2007Date of Patent: December 7, 2010Assignee: Applied Materials, Inc.Inventors: Sam Hyungsam Kim, Jae-Chull Lee, William N. Sterling, Paul Brown
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Patent number: 7822324Abstract: Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.Type: GrantFiled: July 24, 2007Date of Patent: October 26, 2010Assignee: Applied Materials, Inc.Inventors: Suhail Anwar, Jae-Chull Lee, Shinichi Kurita
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Publication number: 20100139889Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.Type: ApplicationFiled: February 22, 2010Publication date: June 10, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
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Patent number: 7665951Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.Type: GrantFiled: June 2, 2006Date of Patent: February 23, 2010Assignee: Applied Materials, Inc.Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
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Patent number: 7497414Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a concave sealing face coupled to an actuator by a flexible coupling. The flexible coupling configured to allow movement of the door member relative to the lever arm in at least two planes.Type: GrantFiled: January 6, 2006Date of Patent: March 3, 2009Assignee: Applied Materials, Inc.Inventors: Jae-Chull Lee, David Berkstresser
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Publication number: 20080118236Abstract: Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.Type: ApplicationFiled: July 24, 2007Publication date: May 22, 2008Inventors: Suhail Anwar, Jae-Chull Lee, Shinichi Kurita
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Publication number: 20080087214Abstract: Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.Type: ApplicationFiled: July 24, 2007Publication date: April 17, 2008Inventors: Jae-Chull Lee, Suhail Anwar, Shinichi Kurita
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Publication number: 20080001113Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.Type: ApplicationFiled: June 24, 2007Publication date: January 3, 2008Inventors: SAM HYUNGSAM KIM, Jae-Chull Lee, William N. Sterling, Paul Brown
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Publication number: 20070280816Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.Type: ApplicationFiled: June 2, 2006Publication date: December 6, 2007Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
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Publication number: 20070166133Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.Type: ApplicationFiled: January 13, 2006Publication date: July 19, 2007Inventors: Jae-Chull Lee, Shinichi Kurita, John M. White, Suhail Anwar
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Publication number: 20060151735Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a concave sealing face coupled to an actuator by a flexible coupling. The flexible coupling configured to allow movement of the door member relative to the lever arm in at least two-planes.Type: ApplicationFiled: January 6, 2006Publication date: July 13, 2006Inventors: Jae-Chull Lee, David Berkstresser