Patents by Inventor Jae-Chull Lee

Jae-Chull Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130263895
    Abstract: A portable cleaning system for a CVD reactor. The cleaning system comprises two components: (1) a stand-mounted gloved box assembly for mounting a flow flange or shower head of a CVD reactor thereto, and (2) a gloved device such as a gloved flange or gloved cylinder for mounting to the reactor chamber. Both components can be equipped with a filtration device for capturing particles that are cleaned out of the CVD reactor. Both systems can be purged with an inert gas to guard against pyrophoric reactions. The system can be used for cleaning existing CVD reactors without the need for costly modification of the CVD reactor to accommodate the cleaning equipment. Also, one cleaning system can be used to service several CVD reactors.
    Type: Application
    Filed: April 6, 2012
    Publication date: October 10, 2013
    Inventors: Jae Chull Lee, Jong Hyuck Lee, Jae Min Lee, Jung Hun Lee
  • Patent number: 8124907
    Abstract: Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: February 28, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Jae-Chull Lee, Suhail Anwar, Shinichi Kurita
  • Patent number: 8061949
    Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: November 22, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
  • Patent number: 7845891
    Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: December 7, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jae-Chull Lee, Shinichi Kurita, John M. White, Suhail Anwar
  • Patent number: 7845618
    Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.
    Type: Grant
    Filed: June 24, 2007
    Date of Patent: December 7, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Sam Hyungsam Kim, Jae-Chull Lee, William N. Sterling, Paul Brown
  • Patent number: 7822324
    Abstract: Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: October 26, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Suhail Anwar, Jae-Chull Lee, Shinichi Kurita
  • Publication number: 20100139889
    Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    Type: Application
    Filed: February 22, 2010
    Publication date: June 10, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
  • Patent number: 7665951
    Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: February 23, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
  • Patent number: 7497414
    Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a concave sealing face coupled to an actuator by a flexible coupling. The flexible coupling configured to allow movement of the door member relative to the lever arm in at least two planes.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: March 3, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Jae-Chull Lee, David Berkstresser
  • Publication number: 20080118236
    Abstract: Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
    Type: Application
    Filed: July 24, 2007
    Publication date: May 22, 2008
    Inventors: Suhail Anwar, Jae-Chull Lee, Shinichi Kurita
  • Publication number: 20080087214
    Abstract: Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.
    Type: Application
    Filed: July 24, 2007
    Publication date: April 17, 2008
    Inventors: Jae-Chull Lee, Suhail Anwar, Shinichi Kurita
  • Publication number: 20080001113
    Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member coupled to an actuator by a ball joint. The ball joint is configured to allow movement of the door member relative to the lever arm around a center of the ball joint. In one embodiment, a sealing face of the elongated door is curved. In another embodiment, the chamber is one of a chemical vapor deposition chamber, a load lock chamber, a metrology chamber, a thermal processing chamber, or a physical vapor disposition chamber, a load lock chamber, a substrate transfer chamber or a vacuum chamber.
    Type: Application
    Filed: June 24, 2007
    Publication date: January 3, 2008
    Inventors: SAM HYUNGSAM KIM, Jae-Chull Lee, William N. Sterling, Paul Brown
  • Publication number: 20070280816
    Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    Type: Application
    Filed: June 2, 2006
    Publication date: December 6, 2007
    Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
  • Publication number: 20070166133
    Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 19, 2007
    Inventors: Jae-Chull Lee, Shinichi Kurita, John M. White, Suhail Anwar
  • Publication number: 20060151735
    Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a concave sealing face coupled to an actuator by a flexible coupling. The flexible coupling configured to allow movement of the door member relative to the lever arm in at least two-planes.
    Type: Application
    Filed: January 6, 2006
    Publication date: July 13, 2006
    Inventors: Jae-Chull Lee, David Berkstresser