Patents by Inventor Jae Han Chung

Jae Han Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH DENSE ROUTABILITY AND HIGH THERMAL CONDUCTIVITY
    Publication number: 20060197209
    Abstract: A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.
    Type: Application
    Filed: December 16, 2005
    Publication date: September 7, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: Bongsuk Choi, Jae Han Chung, Keon Teak Kang