Abstract: Disclosed herein is a novel polymer having a structure based on a biodegradable polymer. In the novel polymer, the biodegradable polymer has at least one kind of functional groups from among a hydroxyl group and a carboxyl group, wherein the biodegradable polymer bears a functional group conjugated with a nitric oxide-releasing compound and a different functional group substituted with a photopolymerizable functional group, the nitric oxide-releasing compound comprising a NO donor. Also provided is a nanofiber fabricated from the modified biodegradable polymer. The nanofiber can be fabricated by electrospinning the novel polymer.

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: A two different process continued performance type product assembly device may include a punching jig having a punch and configured to ascend and descend, a punching tool located on a lower portion of the punching jig and having a punching die that is located below the punch during a punching work, a fusion tool located on the lower portion of the punching jig and having a fusion horn that is located below the punch during a fusion work, and a tool exchange cylinder configured to push the punching die so that the fusion horn secedes from a position below the punch during the punching work and to pull the punching die so that the fusion horn comes into the position below the punch during the fusion work.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: The present invention relates to: a paper-based surface-enhanced Raman scattering (SERS) substrate comprising metal nanoparticles, which are uniformly distributed and adsorbed on a designed pattern and have a diameter of 1 nm to 100 nm; a point-of-care (POC) diagnostic kit, comprising the paper-based SERS substrate; and a method for preparing the paper-based SERS substrate.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: The present invention relates to: a paper-based surface-enhanced Raman scattering (SERS) substrate comprising metal nanoparticles, which are uniformly distributed and adsorbed on a designed pattern and have a diameter of 1 nm to 100 nm; a point-of-care (POC) diagnostic kit, comprising the paper-based SERS substrate; and a method for preparing the paper-based SERS substrate.

Abstract: The present invention relates to a method for producing nanofibers storing and transferring nitric oxide, and nanofibers produced thereby. The present invention may include: a filling step for filling a first material with nitric oxide; a synthesis step for synthesizing a second material having a functional group capable of covalently bonding to the first material; a sol-gel reaction step for carrying out a sol-gel reaction of the first material filled with nitric oxide with the second material to produce a gel; and an electrospinning step for electrospinning the gel to produce a nanofiber.

Abstract: The present disclosure relates to an electron transfer mediator comprising the osmium complex or a salt thereof, a reagent composition for an electrochemical biosensor, and an electrochemical biosensor, where the osmium compound or its salt maintains a stable oxidation-reduction form for an extended time period, a capacity to react with oxidoreductase being capable of performing the redox reaction of the target analytes, and no effect of oxygen partial pressure.

Abstract: A two different process continued performance type product assembly device may include a punching jig having a punch and configured to ascend and descend, a punching tool located on a lower portion of the punching jig and having a punching die that is located below the punch during a punching work, a fusion tool located on the lower portion of the punching jig and having a fusion horn that is located below the punch during a fusion work, and a tool exchange cylinder configured to push the punching die so that the fusion horn secedes from a position below the punch during the punching work and to pull the punching die so that the fusion horn comes into the position below the punch during the fusion work.