Patents by Inventor Jae-Hun Kim
Jae-Hun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230408376Abstract: Provided herein are systems for determining a stretch condition of a tissue and assessing the stiffness of the tissue. Also provided herein are methods for using the systems for measuring stiffness of a tissue, assessing the effect of an agent on a tissue, and identifying subjects having a disease or disorder associated with increased or decreased stiffness of a tissue.Type: ApplicationFiled: June 16, 2023Publication date: December 21, 2023Applicants: Trustees of Boston University, Beth Israel Deaconess Medical Center, Inc.Inventors: Bela Suki, Jae Hun Kim, Joseph Hall, Ramaswamy Krishnan, Niccole Schaible
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Patent number: 11848136Abstract: A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body.Type: GrantFiled: November 19, 2020Date of Patent: December 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11837394Abstract: A coil component may include a body having one surface and the other surface facing each other, and including a molded portion having a core and a cover portion disposed on the molded portion; a wound coil disposed between the molded portion and the cover portion and wound around the core; and a first accommodation groove and a second accommodation groove disposed on the one surface of the body to be spaced apart from each other, and respectively disposed outside of a region of the body corresponding to the core, wherein both end portions of the wound coil are respectively disposed in the first and second accommodation grooves, and a minimum value of a distance between the first and second accommodation grooves is greater than a diameter of the core.Type: GrantFiled: July 30, 2019Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jae Hun Kim
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Patent number: 11830665Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.Type: GrantFiled: August 2, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11830654Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.Type: GrantFiled: November 26, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
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Patent number: 11830662Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.Type: GrantFiled: January 22, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11830652Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.Type: GrantFiled: July 31, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11804324Abstract: A coil component includes a body including a coil having a top coil and a bottom coil connected to each other through a via and an external electrode disposed on an external surface of the body to be connected to the coil. A first insulating layer is disposed on a surface of the top coil, and a second insulating layer is disposed on a surface of the bottom coil. The first and second insulating layers are disposed to extend between the top coil and the bottom coil.Type: GrantFiled: February 26, 2019Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Publication number: 20230343507Abstract: A coil component includes a body, a supporting member disposed within the body, a coil portion including a coil pattern disposed on at least one surface of the supporting member, a via pad connected to the coil pattern, and a via connected to the via pad, and an external electrode disposed on the body and connected to the coil portion. The via includes a plurality of side surfaces, one or more of the side surfaces is covered by the supporting member, and at least a portion of two or more of the side surfaces is non-covered by the supporting member.Type: ApplicationFiled: January 23, 2023Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, In Young Kang
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Publication number: 20230326663Abstract: A coil component includes a body having first and second surfaces opposing each other, third and fourth surfaces opposing each other, and fifth and sixth surfaces connecting the first to fourth surfaces and including a mold portion having a core protruding from one surface and a cover portion disposed on the one surface of the mold portion, a wound coil having a wound portion disposed between the mold portion and the cover portion and wound around the core, a lead-out portion disposed on a side surface of the mold portion and exposed to the sixth surface of the body, and a connection portion connecting the wound portion to the lead-out portion, and an external electrode disposed on the sixth surface of the body and connected to the lead-out portion, wherein the lead-out portion is disposed to be parallel to a winding axis of the wound portion.Type: ApplicationFiled: February 16, 2023Publication date: October 12, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun KIM, In Young KANG
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Publication number: 20230322785Abstract: The present invention provides compounds of the structural Formula (I) and pharmaceutically acceptable salts thereof, wherein, are as defined herein, pharmaceutical compositions comprising one or more such compounds (alone and in combination with one or more other therapeutically active agents), and methods for their preparation and use, alone and in combination with other therapeutic agents, as antagonists of A2a and/or A2b receptors, and in the treatment of a variety of diseases, conditions, or disorders that are mediated, at least in part, by the adenosine A2a receptor and/or the adenosine A2b receptor.Type: ApplicationFiled: July 21, 2022Publication date: October 12, 2023Applicant: Merck Sharp & Dohme LLCInventors: Amjad Ali, Christopher W. Boyce, Jared N. Cumming, Duane DeMong, Thomas H. Graham, Subrahmanyam Gudipati, Andrew J. Hoover, Xianhai Huang, Rongze Kuang, Jae-Hun Kim, Joseph M. Kelly, Yeon-Hee Lim, Michael Man-Chu Lo, Jesus Moreno, Jing Su, Heping Wu, Dong Xiao, Younong Yu, Xiaohong Zhu
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Publication number: 20230326665Abstract: A coil component includes a body having a first surface and a second surface opposing each other, and a first side surface and a second side surface connecting the first surface to the second surface and opposing each other, a wound coil disposed in the body, and including a wound portion wound around a winding axis perpendicular to the first side surface of the body and first and second lead-out portions spaced apart from each other on the first side surface of the body, and first and second external electrodes spaced apart from each other on the first surface of the body, extending only onto the first side surface of the body and connected to the first and second lead-out portions, respectively.Type: ApplicationFiled: January 5, 2023Publication date: October 12, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun KIM, In Young KANG
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Patent number: 11744461Abstract: The present disclosure relates to a retina imaging method in which a light from a light source into two lights is dispersed, at least one eyeground image of the eyeball at a first magnification is obtained by adjusting the paths of the two lights incident on the eyeball, and a plurality of DIC images are obtained at a second magnification higher than the first magnification with respect to the retina of the entirety of the obtained at least one eyeground image by adjusting the paths of the two lights incident on the eyeball.Type: GrantFiled: February 26, 2020Date of Patent: September 5, 2023Assignees: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY, SEOUL NATIONAL UNIVERSITY HOSPITAL, INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATIONInventors: Jae Hun Kim, Dae Yu Kim, Seok Hwan Kim, Youngho Cho, Byeongho Park, Hyo-suk Kim, Subeen Park, Kyoung Min Lee
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Publication number: 20230230751Abstract: A coil component includes: a body including a coil unit disposed therein, and having first and second surfaces opposing each other with lead-out portions of the coil unit extending thereto, respectively, and fifth and sixth surfaces connected to the first and second surfaces and opposing each other; a first external electrode, and including a first connection portion covering the first surface of the body and a first pad portion covering the sixth surface of the body, the first pad portion having a smaller width than the first connection portion; a second external electrode, and including a second connection portion covering the second surface of the body and a second pad portion covering the sixth surface of the body, the second pad portion having a smaller width than the second connection portion; and an insulating layer covering the first and second connection portions.Type: ApplicationFiled: November 21, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum KIM, Jae Hun KIM
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Publication number: 20230223182Abstract: A coil component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other in a second direction; a substrate disposed in the body; a coil unit disposed on the substrate, and including a coil pattern, lead-out portions connected to the coil pattern and contacting the first surface of the body while being spaced apart from the third and fourth surfaces of the body, respectively, and sub lead-out portions spaced apart from the coil pattern; and external electrodes disposed on the first surface of the body and connected to the lead-out portions, respectively, wherein each of the sub lead-out portions occupies a smaller volume within the body than each of the lead-out portions.Type: ApplicationFiled: November 21, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum KIM, Jae Hun KIM
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Patent number: 11694838Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.Type: GrantFiled: November 26, 2019Date of Patent: July 4, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
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Publication number: 20230207185Abstract: A coil component includes a body having a first surface, a coil including a coil pattern having a plurality of turns, a first and second lead-out portions disposed in the body and connected to one end and the other end of the coil, respectively, a first and second dummy lead-out portions disposed in the body and spaced apart from the coil, a first and second external electrodes disposed on the first surface of the body and connected to the first and second lead-out portions, respectively. A coil pattern closest to the first surface among the coil patterns disposed in a region between the first lead-out portion and the first dummy lead-out portion is connected to the first lead-out portion.Type: ApplicationFiled: December 7, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Min KIM, Jae Hun KIM, Chang Yun LEE, Dae Chul CHOI, Se Yeon HWANG, Yeo Ok JEON
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Publication number: 20230194953Abstract: One aspect of the present disclosure is a method for selective surface functionalization using a single-photon source. The method for selective functionalization using a single-photon source includes: (a) adding a single-photon source to a solution containing a photosensitizer and a monomer; and (b) emitting a single photon from the single-photon source. One aspect of the present disclosure is a selectively functionalized single-photon source prepared by the method.Type: ApplicationFiled: September 29, 2022Publication date: June 22, 2023Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Kayoung KIM, Chulki KIM, Jae Hun KIM, Taikjin LEE, Sang Wook HAN, Seungwoo JEON, Yu Kyeong KIM, Young Tae BYUN
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Publication number: 20230177396Abstract: In artificial vision parameter automating method, the system includes a sensory module, a communication module, a database, an image processing module, a learning module and a automating and storing module. The sensory module is configured to take images. The communication module is configured to be send the data obtained from the sensory module to the database. The database is configured to store the images received from the communication module. The image processing module is configured to convert a selected image from the database into a low-resolution phosphene image, to generate test images with various artificial vision parameters. The learning module is configured to extract important features from high-resolution training images, and to build various machine learning models competent at identifying visual stimuli from low-resolution phosphene images. The automating and storing module is configured to automatically select and store primary test data, based on the learning in the learning module.Type: ApplicationFiled: December 6, 2022Publication date: June 8, 2023Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Maesoon IM, Hyeonhee ROH, Na Min AN, Jae Hun KIM
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Publication number: 20230166573Abstract: Disclosed are a vehicle suspension spring device and a vehicle suspension system having the same. The vehicle suspension spring device includes a leaf spring unit comprising at least one leaf spring disposed in a lateral direction of a vehicle, a pair of first coupling parts provided at opposite ends of the leaf spring unit in a longitudinal direction and rotatably coupled to a pair of axles on which opposite wheels of the vehicle are mounted, and a pair of second coupling parts provided at two points between the opposite ends of the leaf spring unit in the longitudinal direction to be rotatably coupled to a subframe of the vehicle.Type: ApplicationFiled: November 14, 2022Publication date: June 1, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOLONGLOTECH. INC, HYUNDAI MOBIS CO., LTD.Inventors: Hyun Soo Kim, Jae Hun Kim, Young Ha Kim, Woo Bin Song, Dong Won Kim, Jun Sung Goo