Patents by Inventor Jae Hur

Jae Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931720
    Abstract: The present invention relates to superabsorbent polymer and a method for preparing the same. According to the method for preparing superabsorbent polymer of the present invention, superabsorbent polymer having improved rewet property and absorption speed can be provided.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: March 19, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Young Jae Hur, Dae Woo Nam, Bohee Park, Seongbeom Heo
  • Patent number: 11918978
    Abstract: Provided is a method of preparing a superabsorbent polymer. More specifically, provided is a method of preparing a superabsorbent polymer capable of exhibiting improved initial absorbency and a rapid absorption rate by polymerizing monomers having acidic groups, of which part is neutralized with a basic material including potassium hydroxide, in the presence of an encapsulated foaming agent.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: March 5, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Seul Ah Lee, Gicheul Kim, Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
  • Publication number: 20230389321
    Abstract: A semiconductor memory device includes a stack structure and a slit structure. The stack structure includes insulation layers and conductive layers alternately stacked with the insulation layers. The slit structure is configured to divide the stack structure into memory blocks. A part of the slit structure configured to define one memory block has a dashed shape including a slit region and a bridge region.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Applicant: SK hynix Inc.
    Inventors: Min Jae HUR, Ji Hyeun SHIN, Ju Hun KIM, Bo Ram PARK, Ji Woong SUE
  • Patent number: 11744068
    Abstract: A semiconductor memory device includes a stack structure and a slit structure. The stack structure includes insulation layers and conductive layers alternately stacked with the insulation layers. The slit structure is configured to divide the stack structure into memory blocks. A part of the slit structure configured to define one memory block has a dashed shape including a slit region and a bridge region.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: August 29, 2023
    Assignee: SK hynix Inc.
    Inventors: Min Jae Hur, Ji Hyeun Shin, Ju Hun Kim, Bo Ram Park, Ji Woong Sue
  • Publication number: 20230149897
    Abstract: The present disclosure relates to a method for preparing a super absorbent polymer. More specifically, it relates to a method for preparing a super absorbent polymer capable of preparing a super absorbent polymer in which the residual monomer content and the extractable content are simultaneously reduced by adding a reducing agent capable of a redox reaction with a thermal polymerization initiator before drying the hydrogel polymer.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 18, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Hyungki YOON, Young Jae HUR, Jin Hyuck JU, Taebin AHN, Dong Hoon PARK, Kwangin SHIN, Jae Soon KIM
  • Patent number: 11613613
    Abstract: The present invention relates to superabsorbent polymer and a method for preparing the same. The present invention can provide a superabsorbent polymer in which a hydrophobic material having an HLB of 0-6, a hydrophilic polymer and a surface cross-linking agent are mixed into a base resin, thereby having improved rewetting characteristics and permeability through surface-modification of the base resin.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 28, 2023
    Inventors: Bohee Park, Dae Woo Nam, Young Jae Hur, Yeon Woo Hong, Jiyoon Jeong
  • Patent number: 11466131
    Abstract: Provided are a superabsorbent polymer and a preparation method thereof, including preparing a base resin and conducting surface modification of the base resin in the presence of an inorganic filler. The method of preparing the superabsorbent polymer of the present invention may provide a superabsorbent polymer having improved rewetting property and liquid permeability.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: October 11, 2022
    Inventors: Young Jae Hur, Dae Woo Nam, Bohee Park, Sujin Kim
  • Patent number: 11370856
    Abstract: The present invention relates to super absorbent polymer and a method for preparing the same. According to the super absorbent polymer and preparation method for the same of the present invention, super absorbent polymer having improved rewet property and vortex time can be provided.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: June 28, 2022
    Inventors: Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
  • Patent number: 11329157
    Abstract: A two-terminal biristor in which a polysilicon emitter layer is inserted and a method of manufacturing the same are provided. The method of manufacturing the two-terminal biristor according to an embodiment of the present disclosure includes forming a first semiconductor layer of a first type on a substrate, forming a second semiconductor layer of a second type on the first semiconductor layer, forming a third semiconductor layer of the first type on the second semiconductor layer, and forming a polysilicon layer of the first type on the third semiconductor layer.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: May 10, 2022
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Yang-Kyu Choi, Jun Woo Son, Jae Hur
  • Publication number: 20220098373
    Abstract: A method of preparing a superabsorbent polymer includes preparing a base resin in which an acrylic acid-based monomer having acidic groups which are at least partially neutralized and an internal crosslinking agent are crosslinked in the presence of a sodium polycarboxylate surfactant; and heating the base resin in the presence of a surface crosslinking agent to carry out surface modification of the base resin, wherein the internal crosslinking agent includes a first epoxy crosslinking agent having an epoxy equivalent weight of 100 g/eq or more to less than 130 g/eq, and a second epoxy crosslinking agent having an epoxy equivalent weight of 130 g/eq or more. The superabsorbent polymer provides improved rewetting property and liquid permeability.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 31, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Dong Hoon Park, Young Jae Hur, Taebin Ahn, Jihye Ryu
  • Patent number: 11288570
    Abstract: A semiconductor channel based neuromorphic synapse device 1 including a trap-rich layer may be provided that includes: a first to a third semiconductor regions which are formed on a substrate and are sequentially arranged; a word line which is electrically connected to the first semiconductor region; a trap-rich layer which surrounds the second semiconductor region; and a bit line which is electrically connected to the third semiconductor region. When a pulse with positive (+) voltage is applied to the word line, a concentration of electrons emitted from the trap-rich layer to the second semiconductor region increases and a resistance of the second semiconductor region decreases. When a pulse with negative (?) voltage is applied to the word line, a concentration of electrons trapped in the trap-rich layer from the second semiconductor region increases and the resistance of the second semiconductor region increases.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: March 29, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yang-Kyu Choi, Jae Hur
  • Publication number: 20220080387
    Abstract: A method of preparing a superabsorbent polymer includes preparing a base resin in which an acrylic acid-based monomer having acidic groups which are at least partially neutralized and an internal crosslinking agent are crosslinked; and heating the base resin in the presence of a surface crosslinking agent to carry out surface modification of the base resin, wherein the internal crosslinking agent includes a first epoxy crosslinking agent having an epoxy equivalent weight of 100 g/eq or more to less than 130 g/eq, and a second epoxy crosslinking agent having an epoxy equivalent weight of 130 g/eq or more. A superabsorbent polymer having improved rewetting property liquid permeability is also provided.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 17, 2022
    Applicant: LG Chem, Ltd.
    Inventors: Young Jae Hur, Taebin Ahn, Dong Hoon Park, Jihye Ryu
  • Publication number: 20210366925
    Abstract: A semiconductor memory device includes a stack structure and a slit structure. The stack structure includes insulation layers and conductive layers alternately stacked with the insulation layers. The slit structure is configured to divide the stack structure into memory blocks. A part of the slit structure configured to define one memory block has a dashed shape including a slit region and a bridge region.
    Type: Application
    Filed: September 16, 2020
    Publication date: November 25, 2021
    Applicant: SK hynix Inc.
    Inventors: Min Jae HUR, Ji Hyeun SHIN, Ju Hun KIM, Bo Ram PARK, Ji Woong SUE
  • Publication number: 20210147640
    Abstract: Provided are a superabsorbent polymer and a preparation method thereof, including preparing a base resin and conducting surface modification of the base resin in the presence of an inorganic filler. The method of preparing the superabsorbent polymer of the present invention may provide a superabsorbent polymer having improved rewetting property and liquid permeability.
    Type: Application
    Filed: September 17, 2019
    Publication date: May 20, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Young Jae Hur, Dae Woo Nam, Bohee Park, Sujin Kim
  • Publication number: 20210113989
    Abstract: The present invention relates to superabsorbent polymer and a method for preparing the same. According to the method for preparing superabsorbent polymer of the present invention, superabsorbent polymer having improved rewet property and absorption speed can be provided.
    Type: Application
    Filed: November 28, 2018
    Publication date: April 22, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Young Jae Hur, Dae Woo Nam, Bohee Park, Seongbeom Heo
  • Patent number: 10960102
    Abstract: A superabsorbent polymer which has excellent initial absorbency and keeps water from flowing out under pressure even after the passage of a long period of time, in which the superabsorbent polymer keeps water from flowing out under pressure even after the passage of a long period of time to exhibit excellent absorbency, and also has an anti-caking property under conditions of high temperature and high humidity to improve storage stability, is provided. The superabsorbent polymer composition of the present invention may be used to improve physical properties of a variety of diapers, potty training pants, incontinence pads, etc., thereby being applied to production of personal absorbent hygiene products having high absorbency and excellent storage stability under conditions of high temperature and high humidity.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 30, 2021
    Inventors: Wook Hwan Noh, Jun Kyu Kim, Jong Hyuk Kwon, Young Jae Hur, Ki Han Kim
  • Patent number: 10916543
    Abstract: A semiconductor device includes first and second active regions extending in a first direction on a substrate and spaced apart from each other in a second direction intersecting the first direction, wherein the first and second active regions overlaps with each other in the second direction, a third active region extending in the first direction on the substrate and spaced apart from the first active region in the second direction. The first active region is positioned between the second and third active regions in the second direction. The first and third active regions partially overlap in the second direction, and a device isolation film is configured to define the first to third active regions.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: February 9, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Uk Han, Taek Yong Kim, Satoru Yamada, Jun Hee Lim, Ki Jae Hur
  • Publication number: 20210023529
    Abstract: Provided is a method of preparing a superabsorbent polymer. More specifically, provided is a method of preparing a superabsorbent polymer capable of exhibiting improved initial absorbency and a rapid absorption rate by polymerizing monomers having acidic groups, of which part is neutralized with a basic material including potassium hydroxide, in the presence of an encapsulated foaming agent.
    Type: Application
    Filed: December 10, 2019
    Publication date: January 28, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Seul Ah Lee, Gicheul Kim, Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
  • Publication number: 20210009725
    Abstract: The present invention relates to super absorbent polymer and a method for preparing the same. According to the super absorbent polymer and preparation method for the same of the present invention, super absorbent polymer having improved rewet property and vortex time can be provided.
    Type: Application
    Filed: March 20, 2019
    Publication date: January 14, 2021
    Applicant: LG Chem, Ltd.
    Inventors: Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
  • Publication number: 20200328305
    Abstract: A two-terminal biristor in which a polysilicon emitter layer is inserted and a method of manufacturing the same are provided. The method of manufacturing the two-terminal biristor according to an embodiment of the present disclosure includes forming a first semiconductor layer of a first type on a substrate, forming a second semiconductor layer of a second type on the first semiconductor layer, forming a third semiconductor layer of the first type on the second semiconductor layer, and forming a polysilicon layer of the first type on the third semiconductor layer.
    Type: Application
    Filed: August 20, 2019
    Publication date: October 15, 2020
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Yang-Kyu CHOI, Jun Woo SON, Jae HUR