Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be highly selectively etched as compared with a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.

Abstract: A semiconductor device is provided. The semiconductor device includes a first stacked structure including a plurality of first insulating patterns and a plurality of first semiconductor patterns alternately stacked on a substrate, the first stacked structure extending in a first direction parallel to an upper surface of the substrate, a first conductive pattern on one side surface of the first stacked structure, the first conductive pattern extending in a second direction crossing the upper surface of the substrate, and a first ferroelectric layer between the first stacked structure and the first conductive pattern, the first ferroelectric layer extending in the second direction, wherein each of the first semiconductor patterns includes a first impurity region, a first channel region and a second impurity region which are sequentially arranged along the first direction.

Abstract: Provided are a silicon nitride film etching composition, a method of etching a silicon nitride film using the same, and a manufacturing method of a semiconductor device. Specifically, a silicon nitride film may be stably etched with a high selection ratio relative to a silicon oxide film, and when the composition is applied to an etching process at a high temperature and a semiconductor manufacturing process, not only no precipitate occurs but also anomalous growth in which the thickness of the silicon oxide film is rather increased does not occur, thereby minimizing defects and reliability reduction.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.

Abstract: An imaging apparatus includes a focal plane shutter that has a simple mechanical structure, is easily manufactured and controlled, and provides a live view function. The focal plane shutter includes: a front curtain assembly including two or more front curtain links and two or more front curtain blades, wherein bosses are formed at one of the front curtain links and the front curtain blades, holes are formed in the remaining one of the front contain links and the front curtain blades, and the bosses are inserted into the holes; and a rear curtain assembly including two or more rear curtain links and two or more rear curtain blades, wherein bosses are formed at one of the rear curtain links and the rear curtain blades, holes are formed in the remaining one of the rear curtain links and the rear curtain blades, and the bosses are inserted into the holes.

Abstract: An imaging apparatus includes a focal plane shutter that has a simple mechanical structure, is easily manufactured and controlled, and provides a live view function. The focal plane shutter includes: a front curtain assembly including two or more front curtain links and two or more front curtain blades, wherein bosses are formed at one of the front curtain links and the front curtain blades, holes are formed in the remaining one of the front contain links and the front curtain blades, and the bosses are inserted into the holes; and a rear curtain assembly including two or more rear curtain links and two or more rear curtain blades, wherein bosses are formed at one of the rear curtain links and the rear curtain blades, holes are formed in the remaining one of the rear curtain links and the rear curtain blades, and the bosses are inserted into the holes.