Patents by Inventor Jae Ky Roh
Jae Ky Roh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10096756Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: GrantFiled: July 5, 2016Date of Patent: October 9, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang Wook Kim, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
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Publication number: 20160315239Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: ApplicationFiled: July 5, 2016Publication date: October 27, 2016Inventors: Chang Wook Kim, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
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Patent number: 7846754Abstract: A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.Type: GrantFiled: August 27, 2009Date of Patent: December 7, 2010Assignee: Samsung LED Co., Ltd.Inventors: Kyung Seob Oh, Jae Ky Roh, Jung Kyu Park, Jong Hwan Baek, Seung Hwan Choi
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Publication number: 20090321779Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: ApplicationFiled: August 28, 2009Publication date: December 31, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Wook KIM, Yoon Suk HAN, Young Jea SONG, Byung Man KIM, Jae Ky ROH, Seong Jae HONG
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Publication number: 20090283792Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.Type: ApplicationFiled: July 28, 2009Publication date: November 19, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Wook KIM, Yoon Suk Han, Young Jae Song, Byung Man Kim, Jae Ky Roh, Seong Jae Hong
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Patent number: 7598528Abstract: A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.Type: GrantFiled: June 13, 2007Date of Patent: October 6, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung Seob Oh, Jae Ky Roh, Jung Kyu Park, Jong Hwan Baek, Seung Hwan Choi
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Publication number: 20080042151Abstract: A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.Type: ApplicationFiled: June 13, 2007Publication date: February 21, 2008Inventors: Kyung Seob Oh, Jae Ky Roh, Jung Kyu Park, Jong Hwan Baek, Seung Hwan Choi
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Patent number: 5979739Abstract: An apparatus for bonding semiconductor dies to lead frame strips, each of the lead frame strips having a plurality of adjacently spaced lead frame units. The apparatus includes at least two bond units, each attaching the dies to one of the lead frame strips at a time and one die supply unit supplying the dies alternately to the bond units. The apparatus also includes at least two lead frame strip supply units, each supplying the lead frame strips to respective ones of the bond units.Type: GrantFiled: October 14, 1997Date of Patent: November 9, 1999Assignee: Samsung Electronics Co., Ltd.Inventors: Ho Tae Jin, Jae Ky Roh, Sung Bok Hong, Hee Kook Choi
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Patent number: 5765277Abstract: A die bonding apparatus for separating a chip from a tested wafer including a plurality of chips and attaching the chip to a lead frame comprising a chip-transferring part for separating the chip from the wafer and transferring the chip to a place where a lead frame is prepared for die bonding; a stage where the transferred chip is placed; a bond head for compressing the chip and the lead frame to bond them together; and a lead frame-transferring part for transferring the lead frame to a predetermined place, the chip-transferring part being comprised of a first rectilinearly moving picking tool and a second revolving picking tool.Type: GrantFiled: September 30, 1996Date of Patent: June 16, 1998Assignee: Samsung Electronics Co., Ltd.Inventors: Ho Tae Jin, Sung Bok Hong, Jae Ky Roh, Hee Kook Choi
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Patent number: D528998Type: GrantFiled: September 19, 2005Date of Patent: September 26, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Jae Song, Jae Ky Roh