Patents by Inventor Jae-Ok Kim

Jae-Ok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178419
    Abstract: An embodiment method of controlling a fuel cell electric vehicle includes determining a required output power amount of a fuel cell stack from a total required output power amount of a battery and the fuel cell stack based on an output power distribution ratio of the fuel cell stack according to a current state of charge (SOC) value of the battery and controlling an operation of the fuel cell stack based on the required output power amount of the fuel cell stack.
    Type: Application
    Filed: March 3, 2023
    Publication date: May 30, 2024
    Inventors: Mi Ji Kim, Joo Yeon Kim, Seong Cheol Jeong, Jae Ok Ha
  • Publication number: 20240149697
    Abstract: A fuel cell vehicle includes a fuel cell stack and a battery, a drive motor configured to drive the vehicle through electrical energy of the fuel cell stack or the battery and to generate electric power through regenerative braking during braking, and a controller configured to set a limit of a regenerative braking output of a drive motor upon braking of the vehicle, taking into consideration a driving environment factor in an exterior of the vehicle, a vehicle manipulation factor of a vehicle driver, and a vehicle driving factor as to a driving state of a vehicle part including the fuel cell stack and the battery.
    Type: Application
    Filed: July 7, 2023
    Publication date: May 9, 2024
    Inventors: Seong Cheol Jeong, Jae Ok Ha, Mi Ji Kim
  • Publication number: 20240127627
    Abstract: Disclosed herein is an apparatus and method for detecting an emotional change through facial expression analysis. The apparatus for detecting an emotional change through facial expression analysis includes a memory having at least one program recorded thereon, and a processor configured to execute the program, wherein the program includes a camera image acquisition unit configured to acquire a moving image including at least one person, a preprocessing unit configured to extract a face image of a user from the moving image and preprocess the extracted face image, a facial expression analysis unit configured to extract a facial expression vector from the face image of the user and cumulatively store the facial expression vector, and an emotional change analysis unit configured to detect a temporal location of a sudden emotional change by analyzing an emotion signal extracted based on cumulatively stored facial expression vector values.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 18, 2024
    Inventors: Byung-Ok HAN, Ho-Won KIM, Jang-Hee YOO, Cheol-Hwan YOO, Jae-Yoon JANG
  • Publication number: 20240120137
    Abstract: A mounting jig for manufacturing a tiling display device can include a supporting member, a plurality of jig magnets fixed to the supporting member, a hinge structure configured to rotate the plurality of jig magnets, and a guard rail configured to rotate in response to a rotation of the plurality of jig magnets, to reduce damage caused during detachment or attachment. The tiling display device includes a plurality of display devices disposed in the form of tiles. Each of the plurality of display devices includes a plurality of display elements, a plurality of circuits, a plurality of lines and a plurality of parts. The plurality of display elements can be a light emitting diode (LED) or a micro-LED including an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Han Seok KIM, Sung Hwan YOON, Sang Ok SEON, Jae Jun KIM
  • Publication number: 20240092141
    Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.
    Type: Application
    Filed: March 8, 2023
    Publication date: March 21, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.
    Inventors: Kwang Ok Han, Young Tae Song, Yong Chul Kim, Gee Young Shin, Su Yeon Kang, Jae Sik Choi, Dae Hee Lee, Byeong Moo Jang, Ung Hwi Kim, Jae Won Cha, Won Jun Joung, Byung Guk An
  • Publication number: 20240098437
    Abstract: Disclosed is an apparatus and method for processing a multichannel audio signal. A multichannel audio signal processing method may include: generating an N-channel audio signal of N channels by down-mixing an M-channel audio signal of M channels; and generating a stereo audio signal by performing binaural rendering of the N-channel audio signal.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Ju LEE, Jeong Il SEO, Seung Kwon BEACK, Kyeong Ok KANG, Jin Woong KIM, Jae Hyoun YOO
  • Patent number: 8486318
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: July 16, 2013
    Assignees: Optopac Co., Ltd., Korea Advanced Institute of Science and Technology, Micropack Co., Ltd.
    Inventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
  • Publication number: 20120272609
    Abstract: A support device of a bearing angle for an architectural stone includes: a supporter having a screw hole formed at the center thereof and being movable along a spiral thread of an anchor bolt fixed to a wall body; and a cutting blade part being formed on the supporter and penetrating into an insulator by a rotational force generated by movement of the supporter so as to be supported in contact with the wall body.
    Type: Application
    Filed: April 6, 2012
    Publication date: November 1, 2012
    Inventor: Jae Ok KIM
  • Publication number: 20120228805
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: May 19, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
  • Publication number: 20120231260
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: May 19, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Deok Hoon KIM, Kyung Wook PAIK, Kyoung Lim SUK, Jae Ok KIM
  • Publication number: 20120231689
    Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
    Type: Application
    Filed: March 29, 2011
    Publication date: September 13, 2012
    Applicants: OPTOPAC CO., LTD, MICROPACK CO., LTD, Korea Advanced Institute of Science and Technology
    Inventors: Deok Hoon Kim, Kyung Wook Paik, Kyoung Lim Suk, Jae Ok Kim
  • Patent number: 7371670
    Abstract: The present invention provides a method for forming an improved dielectric layer for semiconductor devices such as gate structures and capacitors. The method utilizes a layer of (TaO)1-x(TiO)xN (x defined herein) as a substitute for SiO2, together with one or more additional procedures to minimize or prevent channel leakage and other problems that can minimize the performance of the structure.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: May 13, 2008
    Assignee: Hynix Semiconductor Inc.
    Inventors: Kwang-Chul Joo, Jae-Ok Kim
  • Patent number: 6979657
    Abstract: The present invention provides a method for forming an improved dielectric layer for semiconductor devices such as gate structures and capacitors. The method utilizes a layer of (TaO)1?x(TiO)xN (x defined herein) as a substitute for SiO2, together with one or more additional procedures to minimize or prevent channel leakage and other problems that can minimize the performance of the structure.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 27, 2005
    Assignee: Hynix Semiconductor Inc.
    Inventors: Kwang-Chul Joo, Jae-Ok Kim
  • Publication number: 20050202627
    Abstract: The present invention provides a method for forming an improved dielectric layer for semiconductor devices such as gate structures and capacitors. The method utilizes a layer of (TaO)1-x(TiO)xN (x defined herein) as a substitute for SiO2, together with one or more additional procedures to minimize or prevent channel leakage and other problems that can minimize the performance of the structure.
    Type: Application
    Filed: April 8, 2005
    Publication date: September 15, 2005
    Inventors: Kwang-Chul Joo, Jae-Ok Kim
  • Patent number: 6800907
    Abstract: The present invention provides a method for fabricating a semiconductor device capable of suppressing stresses concentrated at bottom corners of a gate electrode as simultaneously as preventing an oxidation of a metal included in a gate electrode. The inventive method includes the steps of: forming a gate oxide layer on a substrate; forming a gate electrode including at least one metal layer on the gate oxide layer; forming an oxide layer on the substrate including the gate electrode at a temperature lower than oxidation temperature of the metal layer; and etching selectively the densified oxide layer so as to form an oxide spacer on the lateral sides of the gate electrode.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: October 5, 2004
    Assignee: Hynix Semiconductor Inc.
    Inventors: Jae-Ok Kim, Woo-Jin Kim, Jong-Hyuk Oh
  • Publication number: 20030216021
    Abstract: The present invention provides a method for fabricating a semiconductor device capable of suppressing stresses concentrated at bottom corners of a gate electrode as simultaneously as preventing an oxidation of a metal included in a gate electrode. The inventive method includes the steps of: forming a gate oxide layer on a substrate; forming a gate electrode including at least one metal layer on the gate oxide layer; forming an oxide layer on the substrate including the gate electrode at a temperature lower than oxidation temperature of the metal layer; and etching selectively the densified oxide layer so as to form an oxide spacer on the lateral sides of the gate electrode.
    Type: Application
    Filed: December 30, 2002
    Publication date: November 20, 2003
    Inventors: Jae-Ok Kim, Woo-Jin Kim, Jong-Hyuk Oh
  • Publication number: 20030100193
    Abstract: The present invention provides a method for forming an improved dielectric layer for semiconductor devices such as gate structures and capacitors. The method utilizes a layer of (TaO)1−x(TiO)xN (x defined herein) as a substitute for SiO2, together with one or more additional procedures to minimize or prevent channel leakage and other problems that can minimize the performance of the structure.
    Type: Application
    Filed: November 15, 2002
    Publication date: May 29, 2003
    Applicant: Hynix Semiconductor Inc.
    Inventors: Kwang-Chul Joo, Jae-Ok Kim