Abstract: The present invention relates to a dry film photoresist comprising the steps of:preparing a photosensitive polymer prepared containing an acrylylic copolymer as a binder polymer, to which is added are a photopolymerizing monomer, photoinitiator, a photosensitive agent, color former, plasticizer and thermal stabilizer; drying the photosensitive polymer coated on a polyethylene terephthalate support in a predetermined thickness; andlaminating a polyethylene terephthalate film with a certain surface property in a protective manner.Since the dry film photoresist of this invention is used for the manufacture of a printed circuit boards and lead frames and employs a polyethylene terephthalate film having excellent surface properties, any problems such as air admixture generated from the process may be avoided, unlike prior technologies using polyethylene film as a cover film, thus reducing significantly the defect rate of a final product.