Patents by Inventor Jae Seok Hwang

Jae Seok Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120323
    Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 11, 2024
    Inventors: Tae Hee LEE, Sung Kook PARK, Kyung Ho KIM, Young Seok SEO, Jae Gwang UM, Sang Hyun LEE, Hyung Suk HWANG
  • Publication number: 20240088059
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 8363377
    Abstract: An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus preventing non-uniform stress from being distributed on the substrate due to external force, therefore maintaining the flatness of the substrate and improving the quality of assembled substrates. The electrostatic chuck may include an electrostatic force generating part provided on an upper surface of the base part, the force generating part including an insulating layer, an electrode layer, a dielectric layer. The base part may be provided with the elastic layer made of the elastic material having elastic restoring force.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: January 29, 2013
    Assignee: ADP Engineering Co., Ltd.
    Inventor: Jae Seok Hwang
  • Patent number: 8245751
    Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: August 21, 2012
    Assignee: Advanced Display Process Engineering Co., Ltd.
    Inventor: Jae Seok Hwang
  • Patent number: 8072573
    Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: December 6, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventors: Jae Seok Hwang, Kyung Mi Kim
  • Patent number: 7980287
    Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: July 19, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventor: Jae Seok Hwang
  • Publication number: 20110067805
    Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
    Type: Application
    Filed: December 1, 2010
    Publication date: March 24, 2011
    Inventors: Jae Seok HWANG, Kyung Mi Kim
  • Patent number: 7864289
    Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: January 4, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventors: Jae Seok Hwang, Kyung Mi Kim
  • Patent number: 7765682
    Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: August 3, 2010
    Assignee: ADP Engineering Co., Ltd.
    Inventors: Jae Seok Hwang, Dong Gun Kim
  • Patent number: 7640960
    Abstract: An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: January 5, 2010
    Assignee: ADP Engineering Co., Ltd.
    Inventors: Dong Gun Kim, Jae Seok Hwang
  • Publication number: 20090141418
    Abstract: An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus preventing non-uniform stress from being distributed on the substrate due to external force, therefore maintaining the flatness of the substrate and improving the quality of assembled substrates. The electrostatic chuck may include an electrostatic force generating part provided on an upper surface of the base part, the force generating part including an insulating layer, an electrode layer, a dielectric layer. The base part may be provided with the elastic layer made of the elastic material having elastic restoring force.
    Type: Application
    Filed: October 22, 2008
    Publication date: June 4, 2009
    Inventor: Jae Seok HWANG
  • Publication number: 20090124158
    Abstract: A system for attaching a display panel and a stereoscopic lens panel is provided. The system may include a panel supply device that receives a display panel and a stereoscopic lens panel, and a conveyance device that conveys the display panel and the stereoscopic lens panel. A cleaning device cleans attachment surfaces of the display panel and stereoscopic lens panel, and a laminating device laminates an adhesive film onto an attachment surface of the display panel. A panel attachment device then attaches the display panel and the stereoscopic lens panel, either of which may be laminated with the adhesive film by the laminating device, and a baking device bakes the adhesive film interposed between the display panel and the stereoscopic lens panel to form a stereoscopic display panel. A panel discharge device then loads the stereoscopic display panel thereon for subsequent processing.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 14, 2009
    Inventor: Jae Seok HWANG
  • Publication number: 20090114348
    Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
    Type: Application
    Filed: October 29, 2008
    Publication date: May 7, 2009
    Inventor: Jae Seok Hwang
  • Publication number: 20090065152
    Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
    Type: Application
    Filed: June 3, 2008
    Publication date: March 12, 2009
    Inventor: Jae Seok HWANG
  • Publication number: 20090056866
    Abstract: A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.
    Type: Application
    Filed: June 3, 2008
    Publication date: March 5, 2009
    Inventors: Jae Seok HWANG, Sung Kwon HWANGBO
  • Publication number: 20080135127
    Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
    Type: Application
    Filed: October 3, 2007
    Publication date: June 12, 2008
    Inventors: Jae Seok HWANG, Kyung Mi Kim
  • Publication number: 20080124199
    Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.
    Type: Application
    Filed: October 3, 2007
    Publication date: May 29, 2008
    Inventors: Jae Seok Hwang, Dong Gun Kim
  • Publication number: 20080124198
    Abstract: An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.
    Type: Application
    Filed: October 3, 2007
    Publication date: May 29, 2008
    Inventors: Dong Gun KIM, Jae Seok Hwang