Abstract: A feeder belt for strip-shaped parts used to feed the strip-shaped parts in various processes such as plating, deflashing, or other processes for manufacturing semiconductors or other articles at industrial scale. By improving the structure of a finger for a feeder belt including a belt body, the separation, fatigue, and the sliding of the finger during feeding of the strip-shaped parts is resolved. Since external force can be applied in the horizontal direction when loading and unloading the strip-shaped parts, peripheral devices are simplified.

Abstract: A fan jet nozzle for use with an ultra high pressure liquid-phase cleaning media for use in a deflashing apparatus includes a nozzle tip, which is made of a super hard material such as diamond, and is secured inside a nozzle holder through sintering. Upper and lower nozzle bores above and beneath the nozzle tip are processed to converge and communicate with each other inside the nozzle tip, resulting in a center nozzle hole having an elliptical shape. One of the upper and lower nozzle bores is processed into a circular cone shape, and the other one of the upper and lower nozzle bores is processed to have an arched longitudinal sectional shape and a cross sectional shape wherein its width increases toward a center thereof and decreases toward both sides thereof.

Abstract: Disclosed herein is a deflash technique for removing flash from a portion of a semiconductor package to be plated before a plating process and after a sealing process accompanied by resin molding during the manufacture of semiconductors, and more particularly a semiconductor package having grooves formed at side flash, a groove forming method, and a deflshing method using the semiconductor package, for removing the side flash formed at a side portion of a lead frame where it is difficult to perform a deflashing process. Conventionally, it is impossible to completely remove side flash remaining on the lead frame at a region where it is difficult to perform a deflashing process even by injecting water jet or media at a very high pressure, or by irradiating laser beams thereto while changing irradiation directions.

Abstract: Disclosed herein is a deflash technique for removing flash from a portion of a semiconductor package to be plated before a plating process and after a sealing process accompanied by resin molding during the manufacture of semiconductors, and more particularly a semiconductor package having grooves formed at side flash, a groove forming method, and a deflshing method using the semiconductor package, for removing the side flash formed at a side portion of a lead frame where it is difficult to perform a deflashing process. Conventionally, it is impossible to completely remove side flash remaining on the lead frame at a region where it is difficult to perform a deflashing process even by injecting water jet or media at a very high pressure, or by irradiating laser beams thereto while changing irradiation directions.